XCZU11EG-3FFVF1517E
XCZU11EG-3FFVF1517E
Image shown is a representation only, Exact specifications should be obtained from the product data sheet.
rohs

AMD Xilinx

XCZU11EG-3FFVF1517E


XCZU11EG-3FFVF1517E
F20-XCZU11EG-3FFVF1517E
Active
CMOS, BGA, BGA1517,39X39,40
BGA, BGA1517,39X39,40

XCZU11EG-3FFVF1517E ECAD Model


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XCZU11EG-3FFVF1517E Attributes


Type Description Select
Rohs Code Yes
Part Life Cycle Code Active
Surface Mount YES
Supply Voltage-Nom 900 mV
uPs/uCs/Peripheral ICs Type MICROPROCESSOR CIRCUIT
Technology CMOS
Supply Voltage-Max 927 mV
Supply Voltage-Min 873 mV
Temperature Grade OTHER
JESD-30 Code R-PBGA-B1517
JESD-609 Code e1
Moisture Sensitivity Level 4
Operating Temperature-Max 100 °C
Peak Reflow Temperature (Cel) 245
Time@Peak Reflow Temperature-Max (s) 30
Number of Terminals 1517
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Shape RECTANGULAR
Package Style GRID ARRAY
Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu)
Terminal Form BALL
Terminal Position BOTTOM
Ihs Manufacturer XILINX INC
Package Description BGA, BGA1517,39X39,40
Reach Compliance Code compliant
ECCN Code 5A002.A.4
HTS Code 8542.39.00.01

XCZU11EG-3FFVF1517E Datasheet Download


XCZU11EG-3FFVF1517E Overview



The XCZU11EG-3FFVF1517E chip model is a revolutionary model in the semiconductor industry, offering a wide range of advantages to users. It is a field-programmable gate array (FPGA) chip model, designed and manufactured by Xilinx, a leading semiconductor company. This model is designed for high-performance applications and is ideal for use in a variety of industries, including automotive, aerospace, and industrial automation.


The XCZU11EG-3FFVF1517E chip model offers a number of advantages to users. It is a highly versatile chip model that can be used for a variety of applications, such as high-speed data processing, image processing, and signal processing. It also offers high-speed data transmission, as well as an impressive level of flexibility. In addition, the chip model is designed with a low power consumption, making it an ideal choice for applications that require low power consumption.


The expected demand for the XCZU11EG-3FFVF1517E chip model is expected to grow significantly in the future. This is because the chip model is ideal for use in a variety of industries and applications, such as automotive, aerospace, and industrial automation. In addition, the chip model is designed to be highly reliable and efficient, making it an ideal choice for applications that require high performance and reliability.


In order to effectively use the XCZU11EG-3FFVF1517E chip model, it is important to understand the product description and specific design requirements. This includes understanding the chip model's architecture, its performance capabilities, and its power consumption. In addition, it is important to understand the actual case studies and precautions associated with the chip model, so that users can ensure that they are using the chip model safely and effectively.


The XCZU11EG-3FFVF1517E chip model can be applied to the development and popularization of future intelligent robots. This is because the chip model is designed to be highly reliable and efficient, making it an ideal choice for applications that require high performance and reliability. In addition, the chip model can be used for a variety of applications, such as image processing, signal processing, and data processing. In order to use the chip model effectively, it is important to have the necessary technical skills and knowledge, such as understanding the chip model's architecture, its performance capabilities, and its power consumption.



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Unit Price: $3,603.4555
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Pricing (USD)

QTY Unit Price Ext Price
1+ $3,351.2136 $3,351.2136
10+ $3,315.1791 $33,151.7906
100+ $3,135.0063 $313,500.6285
1000+ $2,954.8335 $1,477,416.7550
10000+ $2,702.5916 $2,702,591.6250
The price is for reference only, please refer to the actual quotation!

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