
AMD Xilinx
XCZU11EG-3FFVF1517E
XCZU11EG-3FFVF1517E ECAD Model
XCZU11EG-3FFVF1517E Attributes
Type | Description | Select |
---|---|---|
Rohs Code | Yes | |
Part Life Cycle Code | Active | |
Surface Mount | YES | |
Supply Voltage-Nom | 900 mV | |
uPs/uCs/Peripheral ICs Type | MICROPROCESSOR CIRCUIT | |
Technology | CMOS | |
Supply Voltage-Max | 927 mV | |
Supply Voltage-Min | 873 mV | |
Temperature Grade | OTHER | |
JESD-30 Code | R-PBGA-B1517 | |
JESD-609 Code | e1 | |
Moisture Sensitivity Level | 4 | |
Operating Temperature-Max | 100 °C | |
Peak Reflow Temperature (Cel) | 245 | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Number of Terminals | 1517 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Shape | RECTANGULAR | |
Package Style | GRID ARRAY | |
Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) | |
Terminal Form | BALL | |
Terminal Position | BOTTOM | |
Ihs Manufacturer | XILINX INC | |
Package Description | BGA, BGA1517,39X39,40 | |
Reach Compliance Code | compliant | |
ECCN Code | 5A002.A.4 | |
HTS Code | 8542.39.00.01 |
XCZU11EG-3FFVF1517E Datasheet Download
XCZU11EG-3FFVF1517E Overview
The XCZU11EG-3FFVF1517E chip model is a revolutionary model in the semiconductor industry, offering a wide range of advantages to users. It is a field-programmable gate array (FPGA) chip model, designed and manufactured by Xilinx, a leading semiconductor company. This model is designed for high-performance applications and is ideal for use in a variety of industries, including automotive, aerospace, and industrial automation.
The XCZU11EG-3FFVF1517E chip model offers a number of advantages to users. It is a highly versatile chip model that can be used for a variety of applications, such as high-speed data processing, image processing, and signal processing. It also offers high-speed data transmission, as well as an impressive level of flexibility. In addition, the chip model is designed with a low power consumption, making it an ideal choice for applications that require low power consumption.
The expected demand for the XCZU11EG-3FFVF1517E chip model is expected to grow significantly in the future. This is because the chip model is ideal for use in a variety of industries and applications, such as automotive, aerospace, and industrial automation. In addition, the chip model is designed to be highly reliable and efficient, making it an ideal choice for applications that require high performance and reliability.
In order to effectively use the XCZU11EG-3FFVF1517E chip model, it is important to understand the product description and specific design requirements. This includes understanding the chip model's architecture, its performance capabilities, and its power consumption. In addition, it is important to understand the actual case studies and precautions associated with the chip model, so that users can ensure that they are using the chip model safely and effectively.
The XCZU11EG-3FFVF1517E chip model can be applied to the development and popularization of future intelligent robots. This is because the chip model is designed to be highly reliable and efficient, making it an ideal choice for applications that require high performance and reliability. In addition, the chip model can be used for a variety of applications, such as image processing, signal processing, and data processing. In order to use the chip model effectively, it is important to have the necessary technical skills and knowledge, such as understanding the chip model's architecture, its performance capabilities, and its power consumption.
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2,894 In Stock






Pricing (USD)
QTY | Unit Price | Ext Price |
---|---|---|
1+ | $3,351.2136 | $3,351.2136 |
10+ | $3,315.1791 | $33,151.7906 |
100+ | $3,135.0063 | $313,500.6285 |
1000+ | $2,954.8335 | $1,477,416.7550 |
10000+ | $2,702.5916 | $2,702,591.6250 |
The price is for reference only, please refer to the actual quotation! |