XCZU11EG-3FFVC1760E
XCZU11EG-3FFVC1760E
Image shown is a representation only, Exact specifications should be obtained from the product data sheet.
rohs

AMD Xilinx

XCZU11EG-3FFVC1760E


XCZU11EG-3FFVC1760E
F20-XCZU11EG-3FFVC1760E
Active
CMOS, BGA, BGA1760,42X42,40
BGA, BGA1760,42X42,40

XCZU11EG-3FFVC1760E ECAD Model


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XCZU11EG-3FFVC1760E Attributes


Type Description Select
Rohs Code Yes
Part Life Cycle Code Active
Surface Mount YES
Supply Voltage-Nom 900 mV
uPs/uCs/Peripheral ICs Type MICROPROCESSOR CIRCUIT
Technology CMOS
Supply Voltage-Max 927 mV
Supply Voltage-Min 873 mV
Temperature Grade OTHER
JESD-30 Code R-PBGA-B1760
JESD-609 Code e1
Moisture Sensitivity Level 4
Operating Temperature-Max 100 °C
Peak Reflow Temperature (Cel) 245
Time@Peak Reflow Temperature-Max (s) 30
Number of Terminals 1760
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Shape RECTANGULAR
Package Style GRID ARRAY
Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu)
Terminal Form BALL
Terminal Position BOTTOM
Ihs Manufacturer XILINX INC
Package Description BGA, BGA1760,42X42,40
Reach Compliance Code compliant
ECCN Code 5A002.A.4
HTS Code 8542.39.00.01

XCZU11EG-3FFVC1760E Datasheet Download


XCZU11EG-3FFVC1760E Overview



The XCZU11EG-3FFVC1760E chip model is a high-performance, low-power FPGA model produced by Xilinx. It is designed to meet the needs of a wide range of applications, including data centers, artificial intelligence, machine learning, and 5G communications. As a result, this model is becoming increasingly popular in the industry.


The XCZU11EG-3FFVC1760E chip model offers several advantages compared to other chip models. It has a high system integration level, which reduces the power consumption and increases the processing speed. It also has a high-density logic element and a high-speed memory interface, which makes it suitable for applications that require large amounts of data processing. Additionally, the chip model is designed with advanced security features to protect data from unauthorized access.


In terms of future development, the XCZU11EG-3FFVC1760E chip model is expected to become even more popular in the industry. This is due to the growing demand for high-performance, low-power FPGA models. As more and more applications require the support of new technologies, the XCZU11EG-3FFVC1760E chip model is well-positioned to meet these needs.


In terms of product description, the XCZU11EG-3FFVC1760E chip model is a high-performance, low-power FPGA model with a high system integration level. It is designed with an advanced security feature to protect data from unauthorized access, as well as a high-density logic element and a high-speed memory interface. Additionally, the chip model is designed with a range of features to meet the specific needs of a wide range of applications.


When it comes to design requirements, the XCZU11EG-3FFVC1760E chip model should be designed to meet the specific needs of applications. This includes ensuring that the chip model is capable of handling large amounts of data, as well as ensuring that the chip model is secure and able to protect data from unauthorized access. Additionally, the chip model should be designed to be as power-efficient as possible.


In terms of actual case studies, there are several examples of how the XCZU11EG-3FFVC1760E chip model has been used in various applications. For example, it has been used in data centers to process large amounts of data and in artificial intelligence applications to improve the accuracy of predictions. Additionally, the chip model has been used in 5G communications to provide high-speed data transfer and in machine learning applications to improve the accuracy of machine learning algorithms.


Finally, there are several precautions to consider when using the XCZU11EG-3FFVC1760E chip model. For example, it is important to ensure that the chip model is properly secured to protect data from unauthorized access. Additionally, it is important to ensure that the chip model is designed to be as power-efficient as possible, as this will help to reduce power consumption and increase processing speed.


Overall, the XCZU11EG-3FFVC1760E chip model is a high-performance, low-power FPGA model with a range of features to meet the specific needs of a wide range of applications. The chip model is expected to become increasingly popular in the industry due to the growing demand for high-performance, low-power FPGA models. In terms of design requirements and actual case studies, it is important to ensure that the chip model is capable of handling large amounts of data, is secure, and is designed to be as power-efficient as possible. Additionally, it is important to consider the necessary precautions when using the chip model.



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Unit Price: $4,131.1292
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Pricing (USD)

QTY Unit Price Ext Price
1+ $3,841.9502 $3,841.9502
10+ $3,800.6389 $38,006.3886
100+ $3,594.0824 $359,408.2404
1000+ $3,387.5259 $1,693,762.9720
10000+ $3,098.3469 $3,098,346.9000
The price is for reference only, please refer to the actual quotation!

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