
AMD Xilinx
XCZU11EG-3FFVC1760E
XCZU11EG-3FFVC1760E ECAD Model
XCZU11EG-3FFVC1760E Attributes
Type | Description | Select |
---|---|---|
Rohs Code | Yes | |
Part Life Cycle Code | Active | |
Surface Mount | YES | |
Supply Voltage-Nom | 900 mV | |
uPs/uCs/Peripheral ICs Type | MICROPROCESSOR CIRCUIT | |
Technology | CMOS | |
Supply Voltage-Max | 927 mV | |
Supply Voltage-Min | 873 mV | |
Temperature Grade | OTHER | |
JESD-30 Code | R-PBGA-B1760 | |
JESD-609 Code | e1 | |
Moisture Sensitivity Level | 4 | |
Operating Temperature-Max | 100 °C | |
Peak Reflow Temperature (Cel) | 245 | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Number of Terminals | 1760 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Shape | RECTANGULAR | |
Package Style | GRID ARRAY | |
Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) | |
Terminal Form | BALL | |
Terminal Position | BOTTOM | |
Ihs Manufacturer | XILINX INC | |
Package Description | BGA, BGA1760,42X42,40 | |
Reach Compliance Code | compliant | |
ECCN Code | 5A002.A.4 | |
HTS Code | 8542.39.00.01 |
XCZU11EG-3FFVC1760E Datasheet Download
XCZU11EG-3FFVC1760E Overview
The XCZU11EG-3FFVC1760E chip model is a high-performance, low-power FPGA model produced by Xilinx. It is designed to meet the needs of a wide range of applications, including data centers, artificial intelligence, machine learning, and 5G communications. As a result, this model is becoming increasingly popular in the industry.
The XCZU11EG-3FFVC1760E chip model offers several advantages compared to other chip models. It has a high system integration level, which reduces the power consumption and increases the processing speed. It also has a high-density logic element and a high-speed memory interface, which makes it suitable for applications that require large amounts of data processing. Additionally, the chip model is designed with advanced security features to protect data from unauthorized access.
In terms of future development, the XCZU11EG-3FFVC1760E chip model is expected to become even more popular in the industry. This is due to the growing demand for high-performance, low-power FPGA models. As more and more applications require the support of new technologies, the XCZU11EG-3FFVC1760E chip model is well-positioned to meet these needs.
In terms of product description, the XCZU11EG-3FFVC1760E chip model is a high-performance, low-power FPGA model with a high system integration level. It is designed with an advanced security feature to protect data from unauthorized access, as well as a high-density logic element and a high-speed memory interface. Additionally, the chip model is designed with a range of features to meet the specific needs of a wide range of applications.
When it comes to design requirements, the XCZU11EG-3FFVC1760E chip model should be designed to meet the specific needs of applications. This includes ensuring that the chip model is capable of handling large amounts of data, as well as ensuring that the chip model is secure and able to protect data from unauthorized access. Additionally, the chip model should be designed to be as power-efficient as possible.
In terms of actual case studies, there are several examples of how the XCZU11EG-3FFVC1760E chip model has been used in various applications. For example, it has been used in data centers to process large amounts of data and in artificial intelligence applications to improve the accuracy of predictions. Additionally, the chip model has been used in 5G communications to provide high-speed data transfer and in machine learning applications to improve the accuracy of machine learning algorithms.
Finally, there are several precautions to consider when using the XCZU11EG-3FFVC1760E chip model. For example, it is important to ensure that the chip model is properly secured to protect data from unauthorized access. Additionally, it is important to ensure that the chip model is designed to be as power-efficient as possible, as this will help to reduce power consumption and increase processing speed.
Overall, the XCZU11EG-3FFVC1760E chip model is a high-performance, low-power FPGA model with a range of features to meet the specific needs of a wide range of applications. The chip model is expected to become increasingly popular in the industry due to the growing demand for high-performance, low-power FPGA models. In terms of design requirements and actual case studies, it is important to ensure that the chip model is capable of handling large amounts of data, is secure, and is designed to be as power-efficient as possible. Additionally, it is important to consider the necessary precautions when using the chip model.
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2,237 In Stock






Pricing (USD)
QTY | Unit Price | Ext Price |
---|---|---|
1+ | $3,841.9502 | $3,841.9502 |
10+ | $3,800.6389 | $38,006.3886 |
100+ | $3,594.0824 | $359,408.2404 |
1000+ | $3,387.5259 | $1,693,762.9720 |
10000+ | $3,098.3469 | $3,098,346.9000 |
The price is for reference only, please refer to the actual quotation! |