AMD Xilinx
XCZU11EG-3FFVC1156E
XCZU11EG-3FFVC1156E ECAD Model
XCZU11EG-3FFVC1156E Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Surface Mount | YES | |
| Supply Voltage-Nom | 900 mV | |
| uPs/uCs/Peripheral ICs Type | MICROPROCESSOR CIRCUIT | |
| Technology | CMOS | |
| Supply Voltage-Max | 927 mV | |
| Supply Voltage-Min | 873 mV | |
| Temperature Grade | OTHER | |
| JESD-30 Code | R-PBGA-B1156 | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 4 | |
| Operating Temperature-Max | 100 °C | |
| Peak Reflow Temperature (Cel) | 245 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 1156 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Shape | RECTANGULAR | |
| Package Style | GRID ARRAY | |
| Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) | |
| Terminal Form | BALL | |
| Terminal Position | BOTTOM | |
| Ihs Manufacturer | XILINX INC | |
| Package Description | BGA, BGA1156,34X34,40 | |
| Reach Compliance Code | compliant | |
| ECCN Code | 5A002.A.4 | |
| HTS Code | 8542.39.00.01 |
XCZU11EG-3FFVC1156E Datasheet Download
XCZU11EG-3FFVC1156E Overview
The chip model XCZU11EG-3FFVC1156E is a high-performance digital signal processing chip developed by Xilinx Company. It has a wide range of applications, such as embedded processing, image processing, and other high-performance applications. It is designed to be compatible with HDL language, which makes it highly flexible and versatile.
The XCZU11EG-3FFVC1156E chip model has been widely used in many industries, such as telecommunications, automotive, aerospace, and medical. It has become an important part of the technological development of these industries. With the continuous development of these industries, the application of the chip model XCZU11EG-3FFVC1156E is also becoming more and more extensive.
The original design intention of the XCZU11EG-3FFVC1156E chip model is to provide a powerful and reliable platform for digital signal processing, embedded processing, image processing and other applications. It has the ability to process data quickly and accurately, making it suitable for many different applications. In addition, the chip model also has the potential to be upgraded in the future to meet the needs of more advanced communication systems.
The chip model XCZU11EG-3FFVC1156E is a powerful and reliable platform for digital signal processing, embedded processing, image processing, and other applications. It is compatible with HDL language and has the potential to be upgraded in the future to meet the needs of more advanced communication systems. With the rapid development of the industry, it is likely that the chip model XCZU11EG-3FFVC1156E will need to be upgraded to support new technologies in order to meet the needs of the industry. Therefore, it is important to keep up with the industry trends and be aware of the possibilities of future upgrades for the chip model XCZU11EG-3FFVC1156E.
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4,557 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $3,062.3268 | $3,062.3268 |
| 10+ | $3,029.3985 | $30,293.9854 |
| 100+ | $2,864.7573 | $286,475.7315 |
| 1000+ | $2,700.1161 | $1,350,058.0450 |
| 10000+ | $2,469.6184 | $2,469,618.3750 |
| The price is for reference only, please refer to the actual quotation! | ||