XCZU11EG-2FFVC1760I
XCZU11EG-2FFVC1760I
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rohs

AMD Xilinx

XCZU11EG-2FFVC1760I


XCZU11EG-2FFVC1760I
F20-XCZU11EG-2FFVC1760I
Active
CMOS, BGA, BGA1760,42X42,40
BGA, BGA1760,42X42,40

XCZU11EG-2FFVC1760I ECAD Model


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XCZU11EG-2FFVC1760I Attributes


Type Description Select
Rohs Code Yes
Part Life Cycle Code Active
Surface Mount YES
Supply Voltage-Nom 850 mV
uPs/uCs/Peripheral ICs Type MICROPROCESSOR CIRCUIT
Technology CMOS
Supply Voltage-Max 876 mV
Supply Voltage-Min 825 mV
Temperature Grade INDUSTRIAL
JESD-30 Code R-PBGA-B1760
JESD-609 Code e1
Moisture Sensitivity Level 4
Operating Temperature-Max 100 °C
Operating Temperature-Min -40 °C
Peak Reflow Temperature (Cel) 245
Time@Peak Reflow Temperature-Max (s) 30
Number of Terminals 1760
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Shape RECTANGULAR
Package Style GRID ARRAY
Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu)
Terminal Form BALL
Terminal Position BOTTOM
Ihs Manufacturer XILINX INC
Package Description BGA, BGA1760,42X42,40
Reach Compliance Code compliant
ECCN Code 5A002.A.4
HTS Code 8542.39.00.01

XCZU11EG-2FFVC1760I Datasheet Download


XCZU11EG-2FFVC1760I Overview



XCZU11EG-2FFVC1760I is a chip model developed by Xilinx, which is a global leader in the design of programmable logic devices. This chip model is designed to enable the development of advanced systems that require high performance and flexibility. It is a highly integrated chip model that combines a range of features and capabilities that make it suitable for a wide range of applications.


The XCZU11EG-2FFVC1760I chip model has a number of advantages that make it an attractive choice for many applications. It is designed to provide high performance and flexibility, with a wide range of features and capabilities. It is also designed to be highly efficient, with low power consumption and a low cost of ownership. In addition, the chip model is designed to be highly reliable, with a long life cycle and a high level of security.


The XCZU11EG-2FFVC1760I chip model is expected to be in high demand in the future, as the need for advanced systems that require high performance and flexibility increases. The chip model is well suited for applications in the fields of artificial intelligence, machine learning, and 5G networks. It is also expected to be used in the development of advanced communication systems, such as the Internet of Things (IoT) and 5G networks.


The original design intention of the XCZU11EG-2FFVC1760I chip model was to provide a high level of performance and flexibility, while also being highly efficient and reliable. It is designed to support a wide range of features and capabilities, and is expected to be able to handle more complex tasks in the future. The chip model is also expected to be capable of being upgraded and applied to more advanced communication systems, such as 5G networks.


The XCZU11EG-2FFVC1760I chip model is expected to have a wide range of applications in the future, as the demand for advanced communication systems and intelligent scenarios increases. It is expected to be used in the development of 5G networks, as well as in the development of fully intelligent systems. The chip model is expected to be able to handle more complex tasks in the future, and is expected to be able to provide high performance and flexibility. It is also expected to be highly efficient and reliable, with a long life cycle and a high level of security.



3,445 In Stock


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Unit Price: $3,389.7297
The price is for reference only.
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Pricing (USD)

QTY Unit Price Ext Price
1+ $3,152.4486 $3,152.4486
10+ $3,118.5513 $31,185.5132
100+ $2,949.0648 $294,906.4839
1000+ $2,779.5784 $1,389,789.1770
10000+ $2,542.2973 $2,542,297.2750
The price is for reference only, please refer to the actual quotation!

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