
AMD Xilinx
XCZU11EG-2FFVC1760I
XCZU11EG-2FFVC1760I ECAD Model
XCZU11EG-2FFVC1760I Attributes
Type | Description | Select |
---|---|---|
Rohs Code | Yes | |
Part Life Cycle Code | Active | |
Surface Mount | YES | |
Supply Voltage-Nom | 850 mV | |
uPs/uCs/Peripheral ICs Type | MICROPROCESSOR CIRCUIT | |
Technology | CMOS | |
Supply Voltage-Max | 876 mV | |
Supply Voltage-Min | 825 mV | |
Temperature Grade | INDUSTRIAL | |
JESD-30 Code | R-PBGA-B1760 | |
JESD-609 Code | e1 | |
Moisture Sensitivity Level | 4 | |
Operating Temperature-Max | 100 °C | |
Operating Temperature-Min | -40 °C | |
Peak Reflow Temperature (Cel) | 245 | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Number of Terminals | 1760 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Shape | RECTANGULAR | |
Package Style | GRID ARRAY | |
Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) | |
Terminal Form | BALL | |
Terminal Position | BOTTOM | |
Ihs Manufacturer | XILINX INC | |
Package Description | BGA, BGA1760,42X42,40 | |
Reach Compliance Code | compliant | |
ECCN Code | 5A002.A.4 | |
HTS Code | 8542.39.00.01 |
XCZU11EG-2FFVC1760I Datasheet Download
XCZU11EG-2FFVC1760I Overview
XCZU11EG-2FFVC1760I is a chip model developed by Xilinx, which is a global leader in the design of programmable logic devices. This chip model is designed to enable the development of advanced systems that require high performance and flexibility. It is a highly integrated chip model that combines a range of features and capabilities that make it suitable for a wide range of applications.
The XCZU11EG-2FFVC1760I chip model has a number of advantages that make it an attractive choice for many applications. It is designed to provide high performance and flexibility, with a wide range of features and capabilities. It is also designed to be highly efficient, with low power consumption and a low cost of ownership. In addition, the chip model is designed to be highly reliable, with a long life cycle and a high level of security.
The XCZU11EG-2FFVC1760I chip model is expected to be in high demand in the future, as the need for advanced systems that require high performance and flexibility increases. The chip model is well suited for applications in the fields of artificial intelligence, machine learning, and 5G networks. It is also expected to be used in the development of advanced communication systems, such as the Internet of Things (IoT) and 5G networks.
The original design intention of the XCZU11EG-2FFVC1760I chip model was to provide a high level of performance and flexibility, while also being highly efficient and reliable. It is designed to support a wide range of features and capabilities, and is expected to be able to handle more complex tasks in the future. The chip model is also expected to be capable of being upgraded and applied to more advanced communication systems, such as 5G networks.
The XCZU11EG-2FFVC1760I chip model is expected to have a wide range of applications in the future, as the demand for advanced communication systems and intelligent scenarios increases. It is expected to be used in the development of 5G networks, as well as in the development of fully intelligent systems. The chip model is expected to be able to handle more complex tasks in the future, and is expected to be able to provide high performance and flexibility. It is also expected to be highly efficient and reliable, with a long life cycle and a high level of security.
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3,445 In Stock






Pricing (USD)
QTY | Unit Price | Ext Price |
---|---|---|
1+ | $3,152.4486 | $3,152.4486 |
10+ | $3,118.5513 | $31,185.5132 |
100+ | $2,949.0648 | $294,906.4839 |
1000+ | $2,779.5784 | $1,389,789.1770 |
10000+ | $2,542.2973 | $2,542,297.2750 |
The price is for reference only, please refer to the actual quotation! |