XCZU11EG-2FFVC1156I
XCZU11EG-2FFVC1156I
Image shown is a representation only, Exact specifications should be obtained from the product data sheet.
rohs

AMD Xilinx

XCZU11EG-2FFVC1156I


XCZU11EG-2FFVC1156I
F20-XCZU11EG-2FFVC1156I
Active
CMOS, BGA, BGA1156,34X34,40
BGA, BGA1156,34X34,40

XCZU11EG-2FFVC1156I ECAD Model


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XCZU11EG-2FFVC1156I Attributes


Type Description Select
Rohs Code Yes
Part Life Cycle Code Active
Surface Mount YES
Supply Voltage-Nom 850 mV
uPs/uCs/Peripheral ICs Type MICROPROCESSOR CIRCUIT
Technology CMOS
Supply Voltage-Max 876 mV
Supply Voltage-Min 825 mV
Temperature Grade INDUSTRIAL
JESD-30 Code R-PBGA-B1156
JESD-609 Code e1
Moisture Sensitivity Level 4
Operating Temperature-Max 100 °C
Operating Temperature-Min -40 °C
Peak Reflow Temperature (Cel) 245
Time@Peak Reflow Temperature-Max (s) 30
Number of Terminals 1156
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Shape RECTANGULAR
Package Style GRID ARRAY
Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu)
Terminal Form BALL
Terminal Position BOTTOM
Ihs Manufacturer XILINX INC
Package Description BGA, BGA1156,34X34,40
Reach Compliance Code compliant
ECCN Code 5A002.A.4
HTS Code 8542.39.00.01

XCZU11EG-2FFVC1156I Datasheet Download


XCZU11EG-2FFVC1156I Overview



The chip model XCZU11EG-2FFVC1156I is a high-performance digital signal processing, embedded processing, and image processing solution that utilizes HDL language. It is designed to provide a powerful yet energy-efficient solution for a variety of applications.


The XCZU11EG-2FFVC1156I chip model is an ideal choice for high-performance applications that require advanced digital signal processing and embedded processing. It is capable of handling large amounts of data quickly and accurately, making it suitable for a wide range of applications. Additionally, the chip model is designed to be energy efficient, allowing for longer battery life when used in portable devices.


The XCZU11EG-2FFVC1156I chip model is also suitable for image processing tasks. It is capable of handling high-resolution images with ease, making it an ideal choice for applications such as facial recognition and object detection. Additionally, the chip model is designed to be highly scalable, allowing for future upgrades and modifications as needed.


When it comes to the industry trends of the chip model XCZU11EG-2FFVC1156I and the future development of related industries, the chip model can be used in a wide range of applications. It is capable of supporting new technologies such as 5G, AI, and IoT, making it a suitable choice for a variety of applications. Additionally, the chip model is designed to be highly upgradable, allowing for future upgrades and modifications as needed.


The original design intention of the chip model XCZU11EG-2FFVC1156I is to provide a powerful yet energy-efficient solution for a variety of applications. It is capable of handling large amounts of data quickly and accurately, making it suitable for a wide range of applications. Additionally, the chip model is designed to be highly upgradable, allowing for future upgrades and modifications as needed.


The XCZU11EG-2FFVC1156I chip model is also capable of being applied to advanced communication systems. It is designed to be highly scalable and upgradable, allowing for future upgrades and modifications as needed. Additionally, the chip model is capable of supporting new technologies such as 5G, AI, and IoT, making it a suitable choice for a variety of applications.


In conclusion, the XCZU11EG-2FFVC1156I chip model is an ideal choice for high-performance applications that require advanced digital signal processing and embedded processing. It is capable of handling large amounts of data quickly and accurately, making it suitable for a wide range of applications. Additionally, the chip model is designed to be energy efficient, allowing for longer battery life when used in portable devices. It is also capable of being applied to advanced communication systems and is capable of supporting new technologies such as 5G, AI, and IoT. Finally, the chip model is designed to be highly upgradable, allowing for future upgrades and modifications as needed.



4,445 In Stock


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Unit Price: $2,701.4301
The price is for reference only.
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Pricing (USD)

QTY Unit Price Ext Price
1+ $2,512.3300 $2,512.3300
10+ $2,485.3157 $24,853.1569
100+ $2,350.2442 $235,024.4187
1000+ $2,215.1727 $1,107,586.3410
10000+ $2,026.0726 $2,026,072.5750
The price is for reference only, please refer to the actual quotation!

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