AMD Xilinx
XCZU11EG-2FFVB1517I
XCZU11EG-2FFVB1517I ECAD Model
XCZU11EG-2FFVB1517I Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Surface Mount | YES | |
| Supply Voltage-Nom | 850 mV | |
| uPs/uCs/Peripheral ICs Type | MICROPROCESSOR CIRCUIT | |
| Technology | CMOS | |
| Supply Voltage-Max | 876 mV | |
| Supply Voltage-Min | 825 mV | |
| Temperature Grade | INDUSTRIAL | |
| JESD-30 Code | R-PBGA-B1517 | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 4 | |
| Operating Temperature-Max | 100 °C | |
| Operating Temperature-Min | -40 °C | |
| Peak Reflow Temperature (Cel) | 245 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 1517 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Shape | RECTANGULAR | |
| Package Style | GRID ARRAY | |
| Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) | |
| Terminal Form | BALL | |
| Terminal Position | BOTTOM | |
| Ihs Manufacturer | XILINX INC | |
| Package Description | BGA, BGA1517,39X39,40 | |
| Reach Compliance Code | compliant | |
| ECCN Code | 5A002.A.4 | |
| HTS Code | 8542.39.00.01 |
XCZU11EG-2FFVB1517I Datasheet Download
XCZU11EG-2FFVB1517I Overview
The chip model XCZU11EG-2FFVB1517I is a cutting-edge, high-performance solution designed to meet the needs of a variety of applications. It is one of the most advanced solutions in the market today and is expected to become increasingly popular in the future. This model is ideally suited for applications that require high-speed, low-power performance, such as artificial intelligence (AI), machine learning (ML), and 5G communication.
The XCZU11EG-2FFVB1517I is the first model to use the Xilinx UltraScale+ FPGA architecture, which provides superior performance, power efficiency, and scalability. It is equipped with a high-performance, low-power ARM Cortex-A53 processor and a variety of peripherals, such as DDR4 memory, PCIe Gen4, and USB 3.1. This model also features a high-speed transceiver, which enables it to support advanced communication systems.
The XCZU11EG-2FFVB1517I is designed to provide the highest performance and power efficiency for a wide range of applications. It is built with the latest technologies and is capable of supporting a variety of complex algorithms. It is ideal for applications that require high-speed, low-power performance, such as AI, ML, and 5G communication.
As the demand for advanced technologies continues to grow, the XCZU11EG-2FFVB1517I is expected to become increasingly popular in the future. It is designed to provide the highest performance and power efficiency for a wide range of applications. It is also designed to be easily upgraded in the future, so it can continue to support the latest technologies.
In conclusion, the XCZU11EG-2FFVB1517I is a cutting-edge, high-performance solution designed to meet the needs of a variety of applications. It is equipped with the latest technologies and is capable of supporting a variety of complex algorithms. It is expected to become increasingly popular in the future and is designed to be easily upgraded, so it can continue to support the latest technologies. It is ideally suited for applications that require high-speed, low-power performance, such as AI, ML, and 5G communication.
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1,415 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $2,749.3650 | $2,749.3650 |
| 10+ | $2,719.8019 | $27,198.0189 |
| 100+ | $2,571.9866 | $257,198.6568 |
| 1000+ | $2,424.1712 | $1,212,085.6240 |
| 10000+ | $2,217.2298 | $2,217,229.8000 |
| The price is for reference only, please refer to the actual quotation! | ||