AMD Xilinx
XCZU11EG-2FFVB1517E
XCZU11EG-2FFVB1517E ECAD Model
XCZU11EG-2FFVB1517E Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Surface Mount | YES | |
| Supply Voltage-Nom | 850 mV | |
| uPs/uCs/Peripheral ICs Type | MICROPROCESSOR CIRCUIT | |
| Technology | CMOS | |
| Supply Voltage-Max | 876 mV | |
| Supply Voltage-Min | 825 mV | |
| Temperature Grade | OTHER | |
| JESD-30 Code | R-PBGA-B1517 | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 4 | |
| Operating Temperature-Max | 100 °C | |
| Peak Reflow Temperature (Cel) | 245 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 1517 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Shape | RECTANGULAR | |
| Package Style | GRID ARRAY | |
| Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Seated Height-Max | 3.51 mm | |
| Width | 40 mm | |
| Length | 40 mm | |
| Ihs Manufacturer | XILINX INC | |
| Package Description | BGA, BGA1517,39X39,40 | |
| Reach Compliance Code | compliant | |
| ECCN Code | 5A002.A.4 | |
| HTS Code | 8542.39.00.01 | |
| Date Of Intro | 2017-02-15 |
XCZU11EG-2FFVB1517E Datasheet Download
XCZU11EG-2FFVB1517E Overview
The chip model XCZU11EG-2FFVB1517E is a high-performance programmable logic device that is designed to meet the most demanding applications. It is equipped with a dual-core ARM Cortex-A53 processor, a Mali-400 MP2 GPU, and a wide range of peripherals, making it suitable for a variety of applications.
In terms of industry trends, the XCZU11EG-2FFVB1517E chip model is expected to be used in a wide range of industries, including networking, automotive, industrial, and consumer electronics. As the demand for more powerful and efficient devices increases, the chip model is expected to be used in more advanced applications and scenarios.
The original design intention of the chip model XCZU11EG-2FFVB1517E was to provide a powerful, low-power, and low-cost solution for applications that require high performance and flexibility. The chip model is also designed to be upgradable, allowing users to upgrade their devices to keep up with the latest technologies.
The chip model is also expected to be used in advanced communication systems, such as 5G networks, due to its high performance and low-power characteristics. Additionally, the chip model is expected to be used in intelligent scenarios, such as automated driving, robotics, and augmented reality. The chip model is capable of supporting the necessary technologies to enable these intelligent scenarios, such as machine learning and artificial intelligence.
In conclusion, the XCZU11EG-2FFVB1517E chip model is expected to be used in a wide range of industries, from networking to automotive and industrial applications. The chip model is designed to be upgradable, allowing users to keep up with the latest technologies. Additionally, the chip model is expected to be used in advanced communication systems and intelligent scenarios, such as automated driving, robotics, and augmented reality.
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3,084 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $2,406.1573 | $2,406.1573 |
| 10+ | $2,380.2846 | $23,802.8463 |
| 100+ | $2,250.9213 | $225,092.1333 |
| 1000+ | $2,121.5580 | $1,060,779.0190 |
| 10000+ | $1,940.4494 | $1,940,449.4250 |
| The price is for reference only, please refer to the actual quotation! | ||