XCZU11EG-1FFVC1760I
XCZU11EG-1FFVC1760I
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rohs

AMD Xilinx

XCZU11EG-1FFVC1760I


XCZU11EG-1FFVC1760I
F20-XCZU11EG-1FFVC1760I
Active
CMOS, BGA, BGA1760,42X42,40
BGA, BGA1760,42X42,40

XCZU11EG-1FFVC1760I ECAD Model


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XCZU11EG-1FFVC1760I Attributes


Type Description Select
Rohs Code Yes
Part Life Cycle Code Active
Surface Mount YES
Supply Voltage-Nom 850 mV
uPs/uCs/Peripheral ICs Type MICROPROCESSOR CIRCUIT
Technology CMOS
Supply Voltage-Max 876 mV
Supply Voltage-Min 825 mV
Temperature Grade INDUSTRIAL
JESD-30 Code R-PBGA-B1760
JESD-609 Code e1
Moisture Sensitivity Level 4
Operating Temperature-Max 100 °C
Operating Temperature-Min -40 °C
Peak Reflow Temperature (Cel) 245
Time@Peak Reflow Temperature-Max (s) 30
Number of Terminals 1760
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Shape RECTANGULAR
Package Style GRID ARRAY
Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu)
Terminal Form BALL
Terminal Position BOTTOM
Ihs Manufacturer XILINX INC
Package Description BGA, BGA1760,42X42,40
Reach Compliance Code compliant
ECCN Code 5A002.A.4
HTS Code 8542.39.00.01

XCZU11EG-1FFVC1760I Datasheet Download


XCZU11EG-1FFVC1760I Overview



The XCZU11EG-1FFVC1760I chip model is a high performance chip designed for digital signal processing, embedded processing, and image processing. It is based on a field programmable gate array (FPGA) architecture and requires the use of HDL language to program. This chip model has the potential to be used in a variety of applications and scenarios, such as high-performance networking, intelligent systems, and robotics.


In terms of networking, the XCZU11EG-1FFVC1760I chip model can be used to build high-performance networks with a high degree of reliability and scalability. This chip model can be used to design and implement high-speed and low-latency networks with the ability to process large amounts of data in a short amount of time. It is also capable of handling multiple tasks and protocols simultaneously, making it ideal for large-scale networks.


In terms of intelligent systems, the XCZU11EG-1FFVC1760I chip model can be used to develop and implement various types of intelligent systems. This chip model can be used to create intelligent systems that can process and analyze data in real time, as well as respond to the environment. It is also capable of learning from experience and making decisions based on the data it has collected. This makes it ideal for use in the development of intelligent robots, which can be used to automate various tasks and processes.


Finally, in terms of robotics, the XCZU11EG-1FFVC1760I chip model can be used to develop and popularize future intelligent robots. This chip model is capable of handling complex tasks and algorithms, allowing robots to be programmed to perform a variety of tasks. It is also capable of learning from experience and making decisions based on the data it has collected. In order to use this chip model effectively, it is important to have a good understanding of HDL language and robotics programming. Additionally, it is also important to have an understanding of the hardware architecture of FPGAs and the principles of robotics.


In conclusion, the XCZU11EG-1FFVC1760I chip model is an extremely versatile and powerful chip model that can be used for a variety of applications. It is ideal for networking, intelligent systems, and robotics, and it requires a good understanding of HDL language and robotics programming in order to be used effectively. With the increasing popularity of intelligent robotics, this chip model has the potential to be a key component in the development and popularization of future intelligent robots.



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Unit Price: $2,648.3302
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Pricing (USD)

QTY Unit Price Ext Price
1+ $2,462.9471 $2,462.9471
10+ $2,436.4638 $24,364.6378
100+ $2,304.0473 $230,404.7274
1000+ $2,171.6308 $1,085,815.3820
10000+ $1,986.2477 $1,986,247.6500
The price is for reference only, please refer to the actual quotation!

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