AMD Xilinx
XCZU11EG-1FFVC1156E
XCZU11EG-1FFVC1156E ECAD Model
XCZU11EG-1FFVC1156E Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Surface Mount | YES | |
| Supply Voltage-Nom | 850 mV | |
| uPs/uCs/Peripheral ICs Type | MICROPROCESSOR CIRCUIT | |
| Technology | CMOS | |
| Supply Voltage-Max | 876 mV | |
| Supply Voltage-Min | 825 mV | |
| Temperature Grade | OTHER | |
| JESD-30 Code | R-PBGA-B1156 | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 4 | |
| Operating Temperature-Max | 100 °C | |
| Peak Reflow Temperature (Cel) | 245 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 1156 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Shape | RECTANGULAR | |
| Package Style | GRID ARRAY | |
| Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) | |
| Terminal Form | BALL | |
| Terminal Position | BOTTOM | |
| Ihs Manufacturer | XILINX INC | |
| Package Description | BGA, BGA1156,34X34,40 | |
| Reach Compliance Code | compliant | |
| ECCN Code | 5A002.A.4 | |
| HTS Code | 8542.39.00.01 |
XCZU11EG-1FFVC1156E Datasheet Download
XCZU11EG-1FFVC1156E Overview
The chip model XCZU11EG-1FFVC1156E is a highly versatile and powerful device for a variety of applications. It is designed to enable the development of sophisticated, high-performance embedded systems. This chip model is capable of supporting a wide range of technologies, from low-level hardware components to high-level software solutions.
In terms of industry trends, the chip model XCZU11EG-1FFVC1156E is well-suited for the development of future intelligent robots. With its advanced capabilities, it can support the development of robots that can perform complex tasks with a high degree of accuracy. Its powerful processor can handle complex algorithms and its wide range of peripherals can support a variety of sensors and actuators.
The chip model XCZU11EG-1FFVC1156E is also applicable to a variety of other applications. It is capable of supporting advanced communication protocols, such as Wi-Fi, Bluetooth, and ZigBee. In addition, it can also be used for a variety of embedded systems, from industrial automation to consumer electronics.
In order to effectively use the chip model XCZU11EG-1FFVC1156E, there are certain technical skills that are required. These include knowledge of embedded systems, microcontrollers, and programming languages. In addition, the chip model also requires a good understanding of the design principles and the use of development tools, such as the Xilinx Vivado Design Suite.
The chip model XCZU11EG-1FFVC1156E is a powerful and versatile device that can be used in a variety of applications. Its advanced capabilities allow it to be used for the development of sophisticated, high-performance embedded systems. It is also applicable to a variety of other applications, including industrial automation and consumer electronics. In order to use the chip model effectively, certain technical skills are required, such as knowledge of embedded systems, microcontrollers, and programming languages. With its advanced capabilities, the chip model XCZU11EG-1FFVC1156E is well-suited for the development of future intelligent robots and can provide the necessary support for the successful development and popularization of these robots.
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3,000 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $1,570.3614 | $1,570.3614 |
| 10+ | $1,553.4758 | $15,534.7575 |
| 100+ | $1,469.0477 | $146,904.7722 |
| 1000+ | $1,384.6197 | $692,309.8460 |
| 10000+ | $1,266.4205 | $1,266,420.4500 |
| The price is for reference only, please refer to the actual quotation! | ||