AMD Xilinx
XCZU11EG-1FFVB1517I
XCZU11EG-1FFVB1517I ECAD Model
XCZU11EG-1FFVB1517I Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Surface Mount | YES | |
| Supply Voltage-Nom | 850 mV | |
| uPs/uCs/Peripheral ICs Type | MICROPROCESSOR CIRCUIT | |
| Technology | CMOS | |
| Supply Voltage-Max | 876 mV | |
| Supply Voltage-Min | 825 mV | |
| Temperature Grade | INDUSTRIAL | |
| JESD-30 Code | R-PBGA-B1517 | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 4 | |
| Operating Temperature-Max | 100 °C | |
| Operating Temperature-Min | -40 °C | |
| Peak Reflow Temperature (Cel) | 245 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 1517 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Shape | RECTANGULAR | |
| Package Style | GRID ARRAY | |
| Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) | |
| Terminal Form | BALL | |
| Terminal Position | BOTTOM | |
| Ihs Manufacturer | XILINX INC | |
| Package Description | BGA, BGA1517,39X39,40 | |
| Reach Compliance Code | compliant | |
| ECCN Code | 5A002.A.4 | |
| HTS Code | 8542.39.00.01 |
XCZU11EG-1FFVB1517I Datasheet Download
XCZU11EG-1FFVB1517I Overview
The XCZU11EG-1FFVB1517I chip model is a new model from Xilinx that is revolutionizing the semiconductor industry. This model is designed to enable high-speed, low-power, and reliable operations for various applications. It is also capable of supporting a wide range of industry standards, making it an ideal choice for a variety of applications.
The XCZU11EG-1FFVB1517I chip model has several advantages over other models. It is designed to offer high-performance, low-power, and reliable operations. The model is also equipped with advanced features such as the UltraScale+ architecture, which provides a high-speed, low-power, and reliable operation. Additionally, the model is also capable of supporting a wide range of industry standards, making it an ideal choice for a variety of applications.
The XCZU11EG-1FFVB1517I chip model is expected to be in high demand in the coming years due to its advanced features and wide range of applications. This model is expected to be used in a variety of industries, including networking, telecommunications, automotive, and healthcare. It is also expected to be used in the development of intelligent systems, such as the Internet of Things (IoT), and in the development of intelligent robots.
The XCZU11EG-1FFVB1517I chip model is capable of being used in a variety of intelligent scenarios, such as in the development of autonomous vehicles, in the development of smart homes, and in the development of intelligent robots. The model is also capable of being used in the development of fully intelligent systems, such as those needed for the development of the Internet of Things (IoT). In order to use the model effectively, technical talents such as software engineers, hardware engineers, and data scientists are needed.
In conclusion, the XCZU11EG-1FFVB1517I chip model is a revolutionary model from Xilinx that is designed to enable high-speed, low-power, and reliable operations. The model is expected to be in high demand in the coming years due to its advanced features and wide range of applications. It is capable of being used in a variety of intelligent scenarios, such as in the development of autonomous vehicles, in the development of smart homes, and in the development of intelligent robots. In order to use the model effectively, technical talents such as software engineers, hardware engineers, and data scientists are needed.
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1,940 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $2,148.1350 | $2,148.1350 |
| 10+ | $2,125.0368 | $21,250.3679 |
| 100+ | $2,009.5457 | $200,954.5662 |
| 1000+ | $1,894.0545 | $947,027.2660 |
| 10000+ | $1,732.3670 | $1,732,366.9500 |
| The price is for reference only, please refer to the actual quotation! | ||