XCVU3P-3FFVC1517E

The XCVU3P-3FFVC1517E is an FPGA (Field Programmable Gate Array) chip model manufactured by Xilinx. It is a 3D stacked FPGA chip with a 3-level stack of die in a single package. It is built on the Virtex UltraScale+ architecture, and is designed to provide the highest performance and bandwidth for a wide range of applications.

The XCVU3P-3FFVC1517E has a capacity of up to 15.17 million logic cells, and up to 3.9 million memory bits. It has up to 1.3GHz core performance, and up to 7.5 TFLOPS of DSP performance. It also has up to 4.5TB of on-chip memory, and up to 24Gbps of high-speed transceiver data rate. It is designed to provide low-power, high-performance, and high-reliability solutions for a variety of applications.

The XCVU3P-3FFVC1517E is suitable for a wide range of applications, including high-performance computing, machine learning, artificial intelligence, data analytics, video processing, and networking. It is also suitable for applications in the automotive, aerospace, industrial, medical, and defense industries.

The XCVU3P-3FFVC1517E is a highly versatile chip model that is designed to provide the highest performance and bandwidth for a wide range of applications. It has a large capacity, high core and DSP performance, and large on-chip memory. It is suitable for a variety of applications, from high-performance computing to data analytics.