XCVU3P-2FFVC1517E

The XCVU3P-2FFVC1517E is a Field Programmable Gate Array (FPGA) chip model from Xilinx, Inc. It is based on the Virtex UltraScale+ architecture and is designed for high-end applications. The chip has a total of 2.5 million logic cells, 1517 DSP slices, and a maximum clock frequency of up to 1.5 GHz. It also features up to 1.6 TB/s of on-chip memory bandwidth and up to 8.5 TFLOPS of single-precision floating-point performance.

The XCVU3P-2FFVC1517E is designed to handle a wide range of tasks, including data processing, artificial intelligence, machine learning, and high-performance computing. It also supports multiple I/O standards, including PCIe Gen3, SATA, and QSFP. The chip also features multiple high-speed transceivers, including up to 28 Gb/s transceivers, and up to 8.5 TFLOPS of single-precision floating-point performance.

The XCVU3P-2FFVC1517E is ideal for applications such as 5G wireless communication, autonomous driving, image/video processing, and high-performance computing. It is also suitable for applications in aerospace, defense, and industrial automation. It also features advanced security features, such as tamper-proofing and secure boot.

Overall, the XCVU3P-2FFVC1517E is a powerful and versatile FPGA chip model from Xilinx, Inc. It offers a wide range of features and capabilities, making it suitable for a variety of applications in the fields of data processing, artificial intelligence, machine learning, and high-performance computing.