XCVU3P-1FFVC1517E

The XCVU3P-1FFVC1517E is a high-performance field-programmable gate array (FPGA) chip model developed by Xilinx. It is a 3D FPGA chip based on the company's UltraScale+ architecture. It is a mid-range device that offers a balance of capacity, performance, and cost-effectiveness.

The XCVU3P-1FFVC1517E is a 16-nm device that has a capacity of 1.5 million logic cells and a total of 1.5 million flip-flops. It features 17,280 DSP slices, 6,720 block RAMs, and up to 6,720 Kbits of M20K memory. It also has a total of 1,536 I/Os, including four high-speed transceivers.

The XCVU3P-1FFVC1517E is designed for use in a variety of applications, including high-performance computing, data center acceleration, machine learning, and digital signal processing. It is well-suited for applications that require high-speed data processing, such as image and video processing, image recognition, and deep learning.

In addition, the XCVU3P-1FFVC1517E is designed to be power-efficient. It is capable of operating at a power consumption of up to 10.5 W, making it well-suited for applications that require low power consumption.

Overall, the XCVU3P-1FFVC1517E is a powerful and cost-effective FPGA chip model that is well-suited for a variety of applications. It offers a balance of capacity, performance, and power efficiency, making it a great choice for applications that require high-speed data processing.