XCVU27P-L2FSGA2577E
XCVU27P-L2FSGA2577E
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AMD Xilinx

XCVU27P-L2FSGA2577E


XCVU27P-L2FSGA2577E
F20-XCVU27P-L2FSGA2577E
Active
IC FPGA 448 I/O 2577FCBGA
2577-FCBGA (52.5x52.5)

XCVU27P-L2FSGA2577E ECAD Model


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XCVU27P-L2FSGA2577E Attributes


Type Description Select
Mfr AMD Xilinx
Series Virtex® UltraScale+™
Package Tray
Number of LABs/CLBs 162000
Number of Logic Elements/Cells 2835000
Total RAM Bits 74344038
Number of I/O 448
Voltage - Supply 0.698V ~ 0.742V
Mounting Type Surface Mount
Operating Temperature 0°C ~ 100°C (TJ)
Package / Case 2577-BBGA, FCBGA
Supplier Device Package 2577-FCBGA (52.5x52.5)
Base Product Number XCVU27

XCVU27P-L2FSGA2577E Datasheet Download


XCVU27P-L2FSGA2577E Overview



The XCVU27P-L2FSGA2577E is an FPGA chip model from Xilinx. It is a low-power, high-performance, cost-effective FPGA solution for a wide range of applications. It is based on the 28nm UltraScale+ architecture and is optimized for low-power and high-performance applications.


The XCVU27P-L2FSGA2577E chip model has a total of 2577K logic cells and up to 4.3 million system gates. It has a total of 448 DSP slices and up to 1.3 terabits of memory. It also has up to 6.3 Gb/s of transceivers and up to 24.2 Gb/s of LVDS I/O. The chip has an operating voltage range of 0.95V to 1.05V and a maximum power consumption of 11.2W. It is also designed to work with a temperature range of -40°C to +85°C.


The XCVU27P-L2FSGA2577E chip model is suitable for a wide range of applications, including embedded systems, industrial automation, medical imaging, aerospace and defense, machine learning, and networking. It is also well-suited for applications that require high-performance, low-power, and cost-effective solutions.



1,325 In Stock


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Unit Price: $42,291.9687
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Pricing (USD)

QTY Unit Price Ext Price
1+ $39,331.5309 $39,331.5309
10+ $38,908.6112 $389,086.1120
100+ $36,794.0128 $3,679,401.2769
1000+ $34,679.4143 $17,339,707.1670
10000+ $31,718.9765 $31,718,976.5250
The price is for reference only, please refer to the actual quotation!

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