
AMD Xilinx
XCVU27P-L2FSGA2577E
XCVU27P-L2FSGA2577E ECAD Model
XCVU27P-L2FSGA2577E Attributes
Type | Description | Select |
---|---|---|
Mfr | AMD Xilinx | |
Series | Virtex® UltraScale+™ | |
Package | Tray | |
Number of LABs/CLBs | 162000 | |
Number of Logic Elements/Cells | 2835000 | |
Total RAM Bits | 74344038 | |
Number of I/O | 448 | |
Voltage - Supply | 0.698V ~ 0.742V | |
Mounting Type | Surface Mount | |
Operating Temperature | 0°C ~ 100°C (TJ) | |
Package / Case | 2577-BBGA, FCBGA | |
Supplier Device Package | 2577-FCBGA (52.5x52.5) | |
Base Product Number | XCVU27 |
XCVU27P-L2FSGA2577E Datasheet Download
XCVU27P-L2FSGA2577E Overview
The XCVU27P-L2FSGA2577E is an FPGA chip model from Xilinx. It is a low-power, high-performance, cost-effective FPGA solution for a wide range of applications. It is based on the 28nm UltraScale+ architecture and is optimized for low-power and high-performance applications.
The XCVU27P-L2FSGA2577E chip model has a total of 2577K logic cells and up to 4.3 million system gates. It has a total of 448 DSP slices and up to 1.3 terabits of memory. It also has up to 6.3 Gb/s of transceivers and up to 24.2 Gb/s of LVDS I/O. The chip has an operating voltage range of 0.95V to 1.05V and a maximum power consumption of 11.2W. It is also designed to work with a temperature range of -40°C to +85°C.
The XCVU27P-L2FSGA2577E chip model is suitable for a wide range of applications, including embedded systems, industrial automation, medical imaging, aerospace and defense, machine learning, and networking. It is also well-suited for applications that require high-performance, low-power, and cost-effective solutions.
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1,325 In Stock






Pricing (USD)
QTY | Unit Price | Ext Price |
---|---|---|
1+ | $39,331.5309 | $39,331.5309 |
10+ | $38,908.6112 | $389,086.1120 |
100+ | $36,794.0128 | $3,679,401.2769 |
1000+ | $34,679.4143 | $17,339,707.1670 |
10000+ | $31,718.9765 | $31,718,976.5250 |
The price is for reference only, please refer to the actual quotation! |