XCVU190-2FLGA2577I

The XCVU190-2FLGA2577I is a high-performance, low-power field programmable gate array (FPGA) chip model from Xilinx. It is a single-chip device that integrates logic, memory, and digital signal processing (DSP) capabilities. It is based on the Xilinx UltraScale+ architecture and is powered by the Xilinx Vivado Design Suite.

The XCVU190-2FLGA2577I chip has a capacity of 5.9 million logic cells and is housed in a 2577-pin, Flip-Chip Ball Grid Array (FCBGA) package. It has a total of 1.7 million memory bits and a maximum clock frequency of up to 900 MHz. It also features a wide range of I/O options, including up to 16 banks of DDR4 memory, up to 24 banks of QDRII+ and RLDRAM3 memory, up to 8 banks of GDDR5 memory, up to 16 banks of PCIe Gen3, up to 8 banks of Gigabit Ethernet, up to 8 banks of USB3.0, and up to 4 banks of SATA.

The XCVU190-2FLGA2577I chip is suitable for a wide range of applications, including high-performance computing, machine learning, video processing, and network security. It is also suitable for use in data centers, enterprise networks, embedded systems, and automotive applications. It is designed to meet the needs of the most demanding workloads, providing the highest levels of performance, reliability, and scalability.