AMD Xilinx
XCVU160-1FLGB2104C
XCVU160-1FLGB2104C ECAD Model
XCVU160-1FLGB2104C Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Supply Voltage-Nom | 950 mV | |
| Number of Inputs | 702 | |
| Number of Outputs | 702 | |
| Number of Logic Cells | 2026500 | |
| Number of CLBs | 115800 | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Organization | 115800 CLBS | |
| Supply Voltage-Max | 979 mV | |
| Supply Voltage-Min | 922 mV | |
| JESD-30 Code | S-PBGA-B2104 | |
| JESD-609 Code | e1 | |
| Operating Temperature-Max | 85 °C | |
| Number of Terminals | 2104 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA2104,46X46,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | TIN SILVER COPPER | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 47.5 mm | |
| Length | 47.5 mm | |
| Seated Height-Max | 4.32 mm | |
| Ihs Manufacturer | XILINX INC | |
| Reach Compliance Code | not_compliant | |
| HTS Code | 8542.39.00.01 | |
| Package Description | 47.50 X 47.50 MM, 1 MM PITCH, ROHS COMPLIANT, FBGA-2104 |
XCVU160-1FLGB2104C Datasheet Download
XCVU160-1FLGB2104C Overview
The chip model XCVU160-1FLGB2104C is a powerful and versatile chip model that has been used in many different industries. It has been used in the development of advanced communication systems, intelligent robots, and other applications that require complex and sophisticated technology. This chip model is capable of providing high-performance computing power, high-speed communication, and efficient data processing capabilities.
The industry trends of the XCVU160-1FLGB2104C chip model have been rapidly evolving over the last few years. With the development of new technologies, the chip model has been able to keep up with the changing needs of the market. This has allowed the model to remain competitive in the industry and to be used in a variety of applications.
The original design intention of the XCVU160-1FLGB2104C chip model was to provide a powerful, reliable, and efficient computing platform for a wide range of applications. The chip model was designed to be able to handle complex tasks quickly and efficiently, while also providing a robust and secure environment for the data being processed. The chip model is also capable of supporting new technologies as the market evolves and as new applications are developed.
The future development of related industries, as well as whether the application environment requires the support of new technologies, will depend on what specific technologies are needed. The chip model is capable of providing the necessary computing power and communication capabilities to support these new technologies. It is also capable of providing the necessary security measures to protect the data being processed.
The XCVU160-1FLGB2104C chip model can also be used in the development and popularization of future intelligent robots. This chip model is capable of providing the necessary computing power and communication capabilities to support the development of these intelligent robots. It is also capable of providing the necessary security measures to protect the data being processed.
In order to use the XCVU160-1FLGB2104C chip model effectively, it is important to have the right technical talents. These technical talents should have knowledge and experience in the areas of computer programming, data processing, and communication. They should also be familiar with the various technologies that are used in the development of intelligent robots and other applications that require complex and sophisticated technology.
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Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| No reference price found. | ||