XCVU13P-2FLGA2577I

The XCVU13P-2FLGA2577I is a high-performance, low-power FPGA chip from Xilinx. It is built on the company’s state-of-the-art 12nm UltraScale+ technology and offers up to 1.5 million logic cells and up to 8.5 million system logic elements. It also features up to 672 DSP slices, up to 12G transceivers, and up to 4,096 I/Os. This chip is designed to provide enhanced performance, scalability, and power efficiency, making it suitable for a wide range of applications.

The XCVU13P-2FLGA2577I is a versatile chip that can be used in a variety of applications, including artificial intelligence (AI), machine learning (ML), 5G communications, data centers, autonomous vehicles, and more. It is capable of delivering up to 8.5TFLOPS of compute performance, making it ideal for high-performance computing (HPC) applications. Additionally, it is designed to reduce system power consumption by up to 60%, making it suitable for embedded and battery-powered applications.

In terms of specifications, the XCVU13P-2FLGA2577I features a wide range of features, including up to 672 DSP slices, up to 12G transceivers, up to 4,096 I/Os, and up to 1.5 million logic cells. It also features advanced features such as adaptive logic modules, hardened memory controllers, and integrated clocking resources. Additionally, it supports multiple protocols, including PCI Express, Ethernet, and USB.

Overall, the XCVU13P-2FLGA2577I is a powerful and versatile chip that is suitable for a wide range of applications. It is designed to deliver high performance, scalability, and power efficiency, making it ideal for AI, ML, 5G, data centers, and autonomous vehicles. Additionally, it features a wide range of features, including up to 672 DSP slices, up to 12G transceivers, up to 4,096 I/Os, and up to 1.5 million logic cells.