XCVU13P-1FLGA2577E

The XCVU13P-1FLGA2577E is a high-performance field-programmable gate array (FPGA) chip from Xilinx, Inc. It is based on the company’s Virtex UltraScale+ architecture and is designed for a variety of applications in aerospace, defense, industrial, and communications markets. The chip features 13.1 million logic cells, 2.5 million lookup tables, and 2.5 million flip-flops. It also has an integrated DDR4 interface and up to 8GB of on-chip RAM. It has a total power dissipation of up to 180W and a maximum operating temperature of 85°C. It has a maximum clock frequency of 1.5GHz and a power-efficient, low-latency interconnect network. The chip is packaged in a 25mm x 77mm, 1.2mm pitch, flip-chip ball grid array package.

The XCVU13P-1FLGA2577E is suitable for applications that require high-performance computing, such as high-speed, real-time data processing, image processing, machine learning, and artificial intelligence. It is also suitable for applications in high-speed networking, 5G wireless communications, video processing, and high-end embedded systems. The chip is also suitable for aerospace and defense applications, such as radar and sonar systems, avionics, and autonomous vehicle systems. It is also suitable for industrial applications, such as factory automation, robotics, and process control systems.