AMD Xilinx
XCVU11P-2FLGC2104I
XCVU11P-2FLGC2104I ECAD Model
XCVU11P-2FLGC2104I Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Supply Voltage-Nom | 850 mV | |
| Number of Inputs | 624 | |
| Number of Outputs | 624 | |
| Number of Logic Cells | 2835000 | |
| Number of CLBs | 162000 | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | INDUSTRIAL | |
| Package Shape | SQUARE | |
| Organization | 162000 CLBS | |
| Supply Voltage-Max | 876 mV | |
| Supply Voltage-Min | 825 mV | |
| JESD-30 Code | S-PBGA-B2104 | |
| Operating Temperature-Max | 100 °C | |
| Operating Temperature-Min | -40 °C | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Number of Terminals | 2104 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA2104,46X46,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 47.5 mm | |
| Length | 47.5 mm | |
| Seated Height-Max | 4.32 mm | |
| Ihs Manufacturer | XILINX INC | |
| Reach Compliance Code | not_compliant | |
| ECCN Code | 3A001.A.7.B | |
| HTS Code | 8542.39.00.01 | |
| Date Of Intro | 2016-06-03 |
XCVU11P-2FLGC2104I Datasheet Download
XCVU11P-2FLGC2104I Overview
The XCVU11P-2FLGC2104I chip model is a powerful tool for the development of intelligent systems in the near future. Developed by Xilinx, this model is a field-programmable gate array (FPGA) that offers a wide range of features to help create intelligent systems. It is a powerful tool for the development of networks, intelligent scenarios, and even robots.
The XCVU11P-2FLGC2104I chip model is designed to provide a high level of flexibility and scalability. It is specifically designed to be used in the development of intelligent systems and networks. It has a wide range of features including support for high-speed communication, advanced memory management, and a wide range of logic blocks. This makes it a great choice for the development of intelligent systems and networks.
The XCVU11P-2FLGC2104I chip model can be used in a variety of intelligent scenarios. For example, it can be used in the development of intelligent robots. It can also be used in the development of intelligent networks, such as for the development of autonomous vehicles or for the development of smart homes. It can also be used in the development of intelligent systems, such as for the development of smart cities.
In order to effectively use the XCVU11P-2FLGC2104I chip model, it is important to understand the product description and specific design requirements. It is also important to understand the actual case studies and precautions that should be taken when using the model. Additionally, it is important to understand the technical talents that are needed to use the model effectively.
Overall, the XCVU11P-2FLGC2104I chip model is a powerful tool for the development of intelligent systems in the near future. It can be used in a variety of intelligent scenarios, such as for the development of networks, intelligent robots, and intelligent systems. To use the model effectively, it is important to understand the product description, design requirements, case studies, and precautions. Additionally, it is important to understand the technical talents that are needed to use the model effectively.
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1,227 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $37,912.5065 | $37,912.5065 |
| 10+ | $37,504.8451 | $375,048.4512 |
| 100+ | $35,466.5383 | $3,546,653.8320 |
| 1000+ | $33,428.2315 | $16,714,115.7600 |
| 10000+ | $30,574.6020 | $30,574,602.0000 |
| The price is for reference only, please refer to the actual quotation! | ||