XCVU11P-1FLGA2577E

The XCVU11P-1FLGA2577E is a high-performance field-programmable gate array (FPGA) chip from Xilinx. It is built on the 16nm UltraScale+ architecture and features 11.2 million system logic cells, 1.8 million memory bits, and 4,096 DSP slices. It has a total of 2577 I/O pins, and is packaged in a 1.2mm x 1.2mm Flip-Chip Ball Grid Array (FCBGA) package.

The XCVU11P-1FLGA2577E is designed to provide high-performance computing and low-power operation. It has a wide range of features, including DDR4, PCIe Gen3, and 10/25/50/100G Ethernet support. It also features a high-bandwidth memory (HBM2) interface, which enables high-speed data transfer between the FPGA and other components. Additionally, the chip supports a variety of industry-standard protocols, such as VHDL, Verilog, and OpenCL.

The XCVU11P-1FLGA2577E is ideal for a range of applications, including network infrastructure, data centers, embedded systems, and high-performance computing. It can be used for a variety of tasks, including machine learning, artificial intelligence, video processing, and signal processing. Additionally, the chip is suitable for applications that require high-speed data transfer and low-power operation, such as 5G networks and autonomous vehicles.