AMD Xilinx
XCVU095-1FFVC2104I
XCVU095-1FFVC2104I ECAD Model
XCVU095-1FFVC2104I Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Supply Voltage-Nom | 950 mV | |
| Number of Inputs | 832 | |
| Number of Outputs | 832 | |
| Number of Logic Cells | 1176000 | |
| Number of CLBs | 768 | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | INDUSTRIAL | |
| Package Shape | SQUARE | |
| Organization | 768 CLBS | |
| Supply Voltage-Max | 979 mV | |
| Supply Voltage-Min | 922 mV | |
| JESD-30 Code | S-PBGA-B2104 | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 4 | |
| Operating Temperature-Max | 100 °C | |
| Operating Temperature-Min | -40 °C | |
| Peak Reflow Temperature (Cel) | 245 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 2104 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA2104,46X46,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | TIN SILVER COPPER | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 47.5 mm | |
| Length | 47.5 mm | |
| Seated Height-Max | 4.04 mm | |
| Ihs Manufacturer | XILINX INC | |
| Package Description | BGA-2104 | |
| Reach Compliance Code | compliant | |
| ECCN Code | 3A001.A.7.B | |
| HTS Code | 8542.39.00.01 |
XCVU095-1FFVC2104I Datasheet Download
XCVU095-1FFVC2104I Overview
The chip model XCVU095-1FFVC2104I is a highly advanced and versatile model that has been designed with a wide range of applications in mind. It offers a number of advantages over other similar models, including improved performance, better power efficiency, and enhanced reliability. As such, it is expected that demand for the model will continue to increase in the future, particularly in the fields of networking, artificial intelligence, and the Internet of Things.
The XCVU095-1FFVC2104I is designed with a number of features that make it suitable for use in a variety of scenarios. It is capable of supporting a wide range of networking protocols, making it an ideal choice for connecting multiple devices together. It is also capable of supporting multiple intelligent scenarios, such as machine learning and natural language processing. This makes it a great choice for use in the era of fully intelligent systems.
The product description of the XCVU095-1FFVC2104I includes a number of specific design requirements, such as a low power consumption, a high-speed data transfer rate, and a wide range of operating temperatures. Additionally, the model has undergone extensive testing to ensure its reliability and performance in a variety of conditions. This includes actual case studies that have been conducted to test the model's performance in various scenarios.
When using the XCVU095-1FFVC2104I, it is important to take into account a number of precautions. This includes making sure that the model is properly installed and configured, as well as ensuring that the environment in which it is used is suitable for its operation. Additionally, it is important to regularly check the model for any signs of wear or damage, as this could affect its performance.
Overall, the XCVU095-1FFVC2104I is a highly advanced and versatile chip model that is suitable for use in a variety of scenarios. It offers a number of advantages over other similar models, and is expected to become increasingly popular in the future. With its wide range of features, it is suitable for use in networks, artificial intelligence, and the Internet of Things, making it a great choice for the era of fully intelligent systems.
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2,421 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $11,030.8565 | $11,030.8565 |
| 10+ | $10,912.2451 | $109,122.4512 |
| 100+ | $10,319.1883 | $1,031,918.8320 |
| 1000+ | $9,726.1315 | $4,863,065.7600 |
| 10000+ | $8,895.8520 | $8,895,852.0000 |
| The price is for reference only, please refer to the actual quotation! | ||