AMD Xilinx
XCVU095-1FFVB1760C
XCVU095-1FFVB1760C ECAD Model
XCVU095-1FFVB1760C Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Supply Voltage-Nom | 950 mV | |
| Number of Inputs | 832 | |
| Number of Outputs | 832 | |
| Number of Logic Cells | 1176000 | |
| Number of CLBs | 67200 | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Organization | 67200 CLBS | |
| Supply Voltage-Max | 979 mV | |
| Supply Voltage-Min | 922 mV | |
| JESD-30 Code | S-PBGA-B1760 | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 4 | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | 245 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 1760 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA1760,42X42,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | TIN SILVER COPPER | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 42.5 mm | |
| Length | 42.5 mm | |
| Seated Height-Max | 3.71 mm | |
| Ihs Manufacturer | XILINX INC | |
| Package Description | 42.50 X42.50 MM, 1 MM PITCH, ROHS COMPLIANT, FBGA-1760 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 |
XCVU095-1FFVB1760C Datasheet Download
XCVU095-1FFVB1760C Overview
The chip model XCVU095-1FFVB1760C is a powerful and innovative model that offers tremendous potential for the development of future intelligent systems. It is capable of providing the necessary computing power for networks and intelligent applications, and can be used in the era of fully intelligent systems.
The XCVU095-1FFVB1760C is designed to meet the needs of high-end network and intelligent applications. It features an advanced, multi-core processor architecture, which provides a high degree of performance and scalability. The chip includes an integrated memory controller, which enables it to store large amounts of data and to quickly process it. It also includes a powerful GPU, which can be used to render graphics and to process image and video data. Additionally, the chip is equipped with a wide range of I/O ports, which allow it to be connected to a variety of external devices.
The XCVU095-1FFVB1760C can be used in a variety of intelligent scenarios, such as autonomous vehicles, robotics, and artificial intelligence. It can be used to enable robots to move and interact with their environment, as well as to enable them to learn and adapt to new situations. Additionally, the chip can be used to enable intelligent systems to recognize objects, interpret natural language, and make decisions. It can also be used to enable the development of intelligent robots that can interact with humans and perform complex tasks.
In order to use the XCVU095-1FFVB1760C effectively, it is important to understand the product description and specific design requirements of the chip. It is also important to be aware of actual case studies and precautions when using the chip. Additionally, it is important to understand the technical skills and knowledge that are required to use the model effectively.
Overall, the XCVU095-1FFVB1760C is a powerful and innovative chip model that offers tremendous potential for the development of future intelligent systems. It can be used in a variety of intelligent scenarios, and can enable the development of intelligent robots that can interact with humans and perform complex tasks. In order to use the chip effectively, it is important to understand the product description and design requirements, as well as the technical skills and knowledge that are required.
You May Also Be Interested In
3,528 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| No reference price found. | ||