AMD Xilinx
XCV812E-8FGG900I
XCV812E-8FGG900I ECAD Model
XCV812E-8FGG900I Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 1.8 V | |
| Number of Equivalent Gates | 254016 | |
| Number of CLBs | 4704 | |
| Combinatorial Delay of a CLB-Max | 400 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | INDUSTRIAL | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 4704 CLBS, 254016 GATES | |
| Clock Frequency-Max | 416 MHz | |
| Supply Voltage-Max | 1.89 V | |
| Supply Voltage-Min | 1.71 V | |
| JESD-30 Code | S-PBGA-B900 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Peak Reflow Temperature (Cel) | 250 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 900 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 31 mm | |
| Length | 31 mm | |
| Seated Height-Max | 2.6 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | BGA, | |
| Pin Count | 900 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 |
XCV812E-8FGG900I Datasheet Download
XCV812E-8FGG900I Overview
The chip model XCV812E-8FGG900I has been gaining traction in the industry as an advanced technology solution. It is a highly efficient and powerful chip model that offers superior performance in a wide range of applications. It is a versatile model that is suitable for a wide range of industries and applications, from consumer electronics to industrial automation.
The model is designed to offer high performance and low power consumption, making it ideal for the ever-evolving needs of modern industry. It is capable of supporting a wide range of applications, from simple consumer electronics to industrial automation and control systems. It is also designed to be flexible, allowing for the integration of new technologies and features.
The chip model XCV812E-8FGG900I is expected to be in high demand in the coming years as the industry evolves and new technologies are developed. It is expected to be used in a variety of applications, such as in networks and smart home systems. It is also expected to be used in the development of fully intelligent systems, such as self-driving cars and autonomous robots.
The chip model XCV812E-8FGG900I is an ideal solution for the industry, offering superior performance and low power consumption. It is capable of supporting the latest technologies and features, making it suitable for a wide range of applications. With its high performance and efficient design, it is expected to be in high demand in the coming years as the industry evolves and new technologies are developed.
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3,250 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| No reference price found. | ||