AMD Xilinx
XCV812E-8BGG560C
XCV812E-8BGG560C ECAD Model
XCV812E-8BGG560C Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 1.8 V | |
| Number of Equivalent Gates | 254016 | |
| Number of CLBs | 4704 | |
| Combinatorial Delay of a CLB-Max | 400 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | COMMERCIAL | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 4704 CLBS, 254016 GATES | |
| Clock Frequency-Max | 416 MHz | |
| Supply Voltage-Max | 1.89 V | |
| Supply Voltage-Min | 1.71 V | |
| JESD-30 Code | S-PBGA-B560 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 70 °C | |
| Peak Reflow Temperature (Cel) | 260 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 560 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LBGA | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, LOW PROFILE | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1.27 mm | |
| Terminal Position | BOTTOM | |
| Width | 42.5 mm | |
| Length | 42.5 mm | |
| Seated Height-Max | 1.7 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | LBGA, | |
| Pin Count | 560 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 |
XCV812E-8BGG560C Datasheet Download
XCV812E-8BGG560C Overview
The chip model XCV812E-8BGG560C is a powerful tool that has been used in a variety of industries for years. It has been used in networking, computing, and other applications that require high performance and reliability. As technology continues to evolve, the chip model XCV812E-8BGG560C is likely to be used in more complex applications, such as intelligent systems.
The chip model XCV812E-8BGG560C is capable of providing high-speed data processing, which makes it suitable for applications such as networks and intelligent systems. It is capable of handling large amounts of data quickly and efficiently, making it a perfect choice for applications that require high performance. It is also capable of supporting new technologies, such as artificial intelligence, which makes it a great choice for future applications.
The chip model XCV812E-8BGG560C can be used in a variety of intelligent scenarios, such as robotics, autonomous vehicles, and other intelligent systems. It is capable of providing the necessary computing power for these applications, as well as the necessary data processing and storage capacity. It is also capable of supporting the development of new technologies, such as machine learning and deep learning, which can be used to create more powerful and intelligent systems.
In order to use the chip model XCV812E-8BGG560C effectively, certain technical skills are needed. It requires knowledge of programming, networking, and data processing, as well as an understanding of the various technologies that are used in the chip model. It also requires a good understanding of the various applications that the chip model can be used in. With the right skills, the chip model can be used to create powerful and intelligent systems, which can then be used in a variety of intelligent scenarios.
Overall, the chip model XCV812E-8BGG560C is a powerful tool that can be used in a variety of applications. It is capable of providing high-speed data processing and supporting new technologies, making it a great choice for applications that require high performance and reliability. It is also capable of being used in a variety of intelligent scenarios, and with the right technical skills, it can be used to create powerful and intelligent systems.
You May Also Be Interested In
1,356 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| No reference price found. | ||