AMD Xilinx
XCV812E-8BG560I
XCV812E-8BG560I ECAD Model
XCV812E-8BG560I Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 1.8 V | |
| Number of Inputs | 404 | |
| Number of Outputs | 404 | |
| Number of Logic Cells | 21168 | |
| Number of Equivalent Gates | 254016 | |
| Number of CLBs | 4704 | |
| Combinatorial Delay of a CLB-Max | 400 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | INDUSTRIAL | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 4704 CLBS, 254016 GATES | |
| Clock Frequency-Max | 416 MHz | |
| Power Supplies | 1.2/3.6,1.8 V | |
| Supply Voltage-Max | 1.89 V | |
| Supply Voltage-Min | 1.71 V | |
| JESD-30 Code | S-PBGA-B560 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Peak Reflow Temperature (Cel) | 225 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 560 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LBGA | |
| Package Equivalence Code | BGA560,33X33,50 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, LOW PROFILE | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Lead (Sn63Pb37) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1.27 mm | |
| Terminal Position | BOTTOM | |
| Width | 42.5 mm | |
| Length | 42.5 mm | |
| Seated Height-Max | 1.7 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | PLASTIC, BGA-560 | |
| Pin Count | 560 | |
| Reach Compliance Code | not_compliant | |
| HTS Code | 8542.39.00.01 |
XCV812E-8BG560I Datasheet Download
XCV812E-8BG560I Overview
The chip model XCV812E-8BG560I has been gaining attention in the industry for its potential applications in the field of intelligent systems. It is a high-performance, low-power chip model that is capable of supporting a wide variety of applications, including networks, intelligent scenarios, and robots.
As the chip model XCV812E-8BG560I is becoming more widely used, it is important to understand the industry trends and what the future holds for this model. To determine the industry trends, it is important to consider the current and future applications of the chip model. In terms of networks, the chip model is capable of providing high-speed connections and data transmissions. It can also be used in a variety of intelligent scenarios, such as voice recognition, facial recognition, and object detection. Additionally, the chip model has the potential to be used in the development and popularization of intelligent robots.
In addition to understanding the industry trends of the chip model XCV812E-8BG560I, it is important to consider the application environment and whether new technologies are needed. The chip model is capable of supporting a wide range of technologies, including artificial intelligence, machine learning, and deep learning. Additionally, the model is capable of supporting a variety of programming languages, such as Python, Java, and C++.
Finally, it is important to consider the technical talents that are needed to use the chip model XCV812E-8BG560I effectively. To use the model, engineers and developers need to have a strong understanding of artificial intelligence, machine learning, and deep learning. Additionally, they need to have a good understanding of the programming languages that are supported by the chip model. Additionally, engineers and developers need to have a good understanding of the hardware and software components of the chip model.
Overall, the chip model XCV812E-8BG560I has the potential to be used in a variety of applications, including networks, intelligent scenarios, and robots. To ensure the successful application of the model, it is important to consider the industry trends, application environment, and technical talents that are needed to use the model effectively. With the right combination of knowledge and understanding, the chip model XCV812E-8BG560I can be used to develop and popularize future intelligent systems.
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