AMD Xilinx
XCV812E-7FGG900I
XCV812E-7FGG900I ECAD Model
XCV812E-7FGG900I Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 1.8 V | |
| Number of Equivalent Gates | 254016 | |
| Number of CLBs | 4704 | |
| Combinatorial Delay of a CLB-Max | 420 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | INDUSTRIAL | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 4704 CLBS, 254016 GATES | |
| Clock Frequency-Max | 400 MHz | |
| Supply Voltage-Max | 1.89 V | |
| Supply Voltage-Min | 1.71 V | |
| JESD-30 Code | S-PBGA-B900 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Peak Reflow Temperature (Cel) | 250 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 900 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 31 mm | |
| Length | 31 mm | |
| Seated Height-Max | 2.6 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | BGA, | |
| Pin Count | 900 | |
| Reach Compliance Code | compliant | |
| ECCN Code | 3A991.D | |
| HTS Code | 8542.39.00.01 |
XCV812E-7FGG900I Datasheet Download
XCV812E-7FGG900I Overview
The chip model XCV812E-7FGG900I has become a major player in the chip industry. It is a high-performance, low-power, and cost-effective chip, making it a popular choice for many applications. It is also capable of supporting a wide range of technologies, making it a versatile choice for many different scenarios.
The chip model XCV812E-7FGG900I has the potential to be used in a variety of applications, including networks, intelligent systems, and other intelligent scenarios. Its potential applications are only limited by the technologies it supports. It is capable of supporting a wide range of technologies, such as artificial intelligence, machine learning, and 5G networks. This makes it an ideal choice for a wide range of applications, from smart homes to autonomous vehicles.
The product description of the chip model XCV812E-7FGG900I includes its design requirements, performance characteristics, power consumption, and other technical parameters. It is also important to consider the actual case studies and precautions when using the chip model XCV812E-7FGG900I. For example, it is important to consider the temperature range and power supply requirements, as well as the actual performance of the chip in different scenarios.
The chip model XCV812E-7FGG900I is a versatile chip that can be used in a variety of applications and scenarios. Its potential applications are only limited by the technologies it supports, making it an ideal choice for a wide range of applications. It is important to consider the product description and design requirements when using the chip model XCV812E-7FGG900I, as well as actual case studies and precautions. With its wide range of technologies, the chip model XCV812E-7FGG900I has the potential to be used in a variety of applications, including networks, intelligent systems, and other intelligent scenarios.
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4,783 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $491.7185 | $491.7185 |
| 10+ | $486.4312 | $4,864.3123 |
| 100+ | $459.9948 | $45,999.4752 |
| 1000+ | $433.5583 | $216,779.1360 |
| 10000+ | $396.5472 | $396,547.2000 |
| The price is for reference only, please refer to the actual quotation! | ||