XCV812E-7FGG900C
XCV812E-7FGG900C
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rohs

AMD Xilinx

XCV812E-7FGG900C


XCV812E-7FGG900C
F20-XCV812E-7FGG900C
Active
FIELD PROGRAMMABLE GATE ARRAY, CMOS, BGA
BGA

XCV812E-7FGG900C ECAD Model


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XCV812E-7FGG900C Attributes


Type Description Select
Pbfree Code Yes
Rohs Code Yes
Part Life Cycle Code Obsolete
Supply Voltage-Nom 1.8 V
Number of Equivalent Gates 254016
Number of CLBs 4704
Combinatorial Delay of a CLB-Max 420 ps
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Temperature Grade COMMERCIAL
Package Shape SQUARE
Technology CMOS
Organization 4704 CLBS, 254016 GATES
Clock Frequency-Max 400 MHz
Supply Voltage-Max 1.89 V
Supply Voltage-Min 1.71 V
JESD-30 Code S-PBGA-B900
Qualification Status Not Qualified
JESD-609 Code e1
Moisture Sensitivity Level 3
Operating Temperature-Max 70 °C
Peak Reflow Temperature (Cel) 250
Time@Peak Reflow Temperature-Max (s) 30
Number of Terminals 900
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Shape SQUARE
Package Style GRID ARRAY
Surface Mount YES
Terminal Finish Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Width 31 mm
Length 31 mm
Seated Height-Max 2.6 mm
Ihs Manufacturer XILINX INC
Part Package Code BGA
Package Description BGA,
Pin Count 900
Reach Compliance Code compliant
HTS Code 8542.39.00.01
ECCN Code 3A991.D

XCV812E-7FGG900C Datasheet Download


XCV812E-7FGG900C Overview



The chip model XCV812E-7FGG900C is a high-performance integrated circuit designed for digital signal processing, embedded processing, and image processing. It is capable of providing a wide range of features, including high-speed data transfer, low-power consumption, and flexible programming. In addition, it is designed to be compatible with the HDL language, making it easier to use and program.


The original design intention of the XCV812E-7FGG900C was to create a chip that could handle a wide range of tasks and be used in a variety of applications. It was designed with the intention of being able to handle high-performance digital signal processing and embedded processing, as well as being able to perform image processing and other tasks. The design also allows for future upgrades, so that it can be used in more advanced communication systems.


The product description of the XCV812E-7FGG900C includes a wide range of features, such as high-speed data transfer, low-power consumption, and flexible programming. It also includes a wide range of programming options, such as the ability to use HDL language and other programming languages. Furthermore, the chip also includes a wide range of safety features, such as error correction and data protection.


Case studies have been conducted on the XCV812E-7FGG900C, and the results show that it is capable of handling a wide range of tasks and applications. In addition, it has been found to be reliable and efficient, with a low power consumption. Furthermore, it has been found to be compatible with a wide range of programming languages, such as HDL.


When using the XCV812E-7FGG900C, it is important to follow the instructions provided in the product manual. This includes ensuring that the chip is correctly installed and configured, and that it is properly programmed. It is also important to ensure that the chip is properly maintained, and that any upgrades or modifications are done in accordance with the manufacturer's instructions. Furthermore, it is important to keep the chip in a safe environment, and to avoid exposing it to extreme temperatures or humidity.



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QTY Unit Price Ext Price
1+ $491.7185 $491.7185
10+ $486.4312 $4,864.3123
100+ $459.9948 $45,999.4752
1000+ $433.5583 $216,779.1360
10000+ $396.5472 $396,547.2000
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