AMD Xilinx
XCV812E-7BGG560I
XCV812E-7BGG560I ECAD Model
XCV812E-7BGG560I Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 1.8 V | |
| Number of Equivalent Gates | 254016 | |
| Number of CLBs | 4704 | |
| Combinatorial Delay of a CLB-Max | 420 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | INDUSTRIAL | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 4704 CLBS, 254016 GATES | |
| Clock Frequency-Max | 400 MHz | |
| Supply Voltage-Max | 1.89 V | |
| Supply Voltage-Min | 1.71 V | |
| JESD-30 Code | S-PBGA-B560 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Peak Reflow Temperature (Cel) | 260 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 560 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LBGA | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, LOW PROFILE | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1.27 mm | |
| Terminal Position | BOTTOM | |
| Width | 42.5 mm | |
| Length | 42.5 mm | |
| Seated Height-Max | 1.7 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | LBGA, | |
| Pin Count | 560 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 |
XCV812E-7BGG560I Datasheet Download
XCV812E-7BGG560I Overview
The XCV812E-7BGG560I chip model is a powerful, energy-efficient processor designed for a variety of applications. It is designed to provide high performance and low power consumption, making it an ideal choice for a wide range of applications.
The original design intention of the XCV812E-7BGG560I chip model was to enable the integration of advanced communication systems with high performance and low power consumption. It is equipped with an advanced instruction set, a high-speed data bus, and a large on-chip memory. Its internal architecture is designed to support a variety of communication protocols and algorithms. This allows the chip model to be used in a wide range of communication systems, from basic data transmission to complex network communication.
The XCV812E-7BGG560I chip model is designed to be upgradeable and can be used in advanced communication systems. It is capable of supporting the latest communication protocols and algorithms, such as 4G/5G cellular networks, Wi-Fi, Bluetooth, and Zigbee. It also supports a variety of intelligent scenarios, such as voice recognition, natural language processing, and machine learning. This makes it an ideal choice for the era of fully intelligent systems.
The product description and specific design requirements of the XCV812E-7BGG560I chip model are outlined in its user manual. This includes information on its power consumption, operating temperature, and memory size. It also includes a detailed description of the internal architecture and its features. In addition, the user manual provides actual case studies and precautions for using the chip model.
In conclusion, the XCV812E-7BGG560I chip model is a powerful, energy-efficient processor designed for a variety of applications. It is designed to provide high performance and low power consumption, making it an ideal choice for a wide range of applications. It is upgradeable and can be used in advanced communication systems, as well as a variety of intelligent scenarios. The product description and specific design requirements of the chip model are outlined in its user manual, which also includes actual case studies and precautions.
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| QTY | Unit Price | Ext Price |
|---|---|---|
| No reference price found. | ||