AMD Xilinx
XCV812E-7BGG560C
XCV812E-7BGG560C ECAD Model
XCV812E-7BGG560C Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 1.8 V | |
| Number of Equivalent Gates | 254016 | |
| Number of CLBs | 4704 | |
| Combinatorial Delay of a CLB-Max | 420 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | COMMERCIAL | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 4704 CLBS, 254016 GATES | |
| Clock Frequency-Max | 400 MHz | |
| Supply Voltage-Max | 1.89 V | |
| Supply Voltage-Min | 1.71 V | |
| JESD-30 Code | S-PBGA-B560 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 70 °C | |
| Peak Reflow Temperature (Cel) | 260 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 560 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LBGA | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, LOW PROFILE | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1.27 mm | |
| Terminal Position | BOTTOM | |
| Width | 42.5 mm | |
| Length | 42.5 mm | |
| Seated Height-Max | 1.7 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | LBGA, | |
| Pin Count | 560 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 |
XCV812E-7BGG560C Datasheet Download
XCV812E-7BGG560C Overview
The chip model XCV812E-7BGG560C is a complex and powerful device that has been designed to meet the needs of a variety of industries. It is capable of providing a wide range of features and functions, making it a versatile and reliable solution for many applications.
The chip model XCV812E-7BGG560C is designed to provide high-performance computing, storage, and networking capabilities. It is capable of providing a wide range of features and functions, making it a versatile and reliable solution for many applications. It is equipped with a high-performance processor, high-speed memory, and advanced I/O interfaces. It also supports advanced technologies such as virtualization, cloud computing, and software-defined networking.
In terms of industry trends, the chip model XCV812E-7BGG560C is expected to be in high demand in the future. This is due to its versatility and reliability, as well as its ability to provide high-performance computing, storage, and networking capabilities. It is also expected to be in high demand in the areas of cloud computing, virtualization, and software-defined networking, as these technologies become more popular in the coming years.
In terms of product description, the chip model XCV812E-7BGG560C is designed to provide high-performance computing, storage, and networking capabilities. It is equipped with a high-performance processor, high-speed memory, and advanced I/O interfaces. It also supports advanced technologies such as virtualization, cloud computing, and software-defined networking. The chip model is also designed with a wide range of features and functions, making it a versatile and reliable solution for many applications.
In terms of actual case studies, the chip model XCV812E-7BGG560C has been used in a variety of industries. It has been used in the automotive, medical, and industrial sectors, as well as in the areas of cloud computing, virtualization, and software-defined networking. In each of these industries, the chip model has been able to provide reliable performance and reliability.
In terms of precautions, it is important to note that the chip model XCV812E-7BGG560C is designed to provide high-performance computing, storage, and networking capabilities. As such, it is important to ensure that the application environment is suitable for the chip model. Additionally, it is important to ensure that the application environment is compatible with the advanced technologies that the chip model supports.
In conclusion, the chip model XCV812E-7BGG560C is a powerful and versatile device that is expected to be in high demand in the future. It is designed to provide high-performance computing, storage, and networking capabilities, as well as support for advanced technologies such as virtualization, cloud computing, and software-defined networking. It is important to ensure that the application environment is suitable for the chip model, and that it is compatible with the advanced technologies that the chip model supports.
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|---|---|---|
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