AMD Xilinx
XCV812E-7BG560I
XCV812E-7BG560I ECAD Model
XCV812E-7BG560I Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 1.8 V | |
| Number of Inputs | 404 | |
| Number of Outputs | 404 | |
| Number of Logic Cells | 21168 | |
| Number of Equivalent Gates | 254016 | |
| Number of CLBs | 4704 | |
| Combinatorial Delay of a CLB-Max | 420 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | INDUSTRIAL | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 4704 CLBS, 254016 GATES | |
| Clock Frequency-Max | 400 MHz | |
| Power Supplies | 1.2/3.6,1.8 V | |
| Supply Voltage-Max | 1.89 V | |
| Supply Voltage-Min | 1.71 V | |
| JESD-30 Code | S-PBGA-B560 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Peak Reflow Temperature (Cel) | 225 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 560 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LBGA | |
| Package Equivalence Code | BGA560,33X33,50 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, LOW PROFILE | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Lead (Sn63Pb37) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1.27 mm | |
| Terminal Position | BOTTOM | |
| Width | 42.5 mm | |
| Length | 42.5 mm | |
| Seated Height-Max | 1.7 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | PLASTIC, BGA-560 | |
| Pin Count | 560 | |
| Reach Compliance Code | not_compliant | |
| HTS Code | 8542.39.00.01 | |
| ECCN Code | 3A991.D |
XCV812E-7BG560I Datasheet Download
XCV812E-7BG560I Overview
The XCV812E-7BG560I chip model is a powerful tool for digital signal processing, embedded processing, and image processing. It requires the use of HDL language, which is a robust language for creating digital circuits. With its high performance capabilities, the XCV812E-7BG560I chip model can be used to create complex systems for a variety of applications.
The XCV812E-7BG560I chip model can be used to create networks and intelligent systems. It can be used to develop and popularize future intelligent robots, allowing for the creation of powerful and sophisticated machines. In order to use the XCV812E-7BG560I chip model effectively, technical talents such as software engineers, hardware engineers, and system designers are required. These professionals must be knowledgeable in HDL language, as well as the various components of the XCV812E-7BG560I chip model.
The XCV812E-7BG560I chip model is an incredibly powerful tool for creating digital systems. It can be used in a variety of applications, from high-performance digital signal processing to embedded processing and image processing. It is also capable of creating networks and intelligent systems, making it an invaluable tool for the development and popularization of future intelligent robots. In order to use the XCV812E-7BG560I chip model effectively, technical talents such as software engineers, hardware engineers, and system designers are required. With its high performance capabilities, the XCV812E-7BG560I chip model can be used to create complex systems for a variety of applications, making it an invaluable tool for the development and popularization of future intelligent robots and the era of fully intelligent systems.
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