AMD Xilinx
XCV812E-6FGG900I
XCV812E-6FGG900I ECAD Model
XCV812E-6FGG900I Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 1.8 V | |
| Number of Equivalent Gates | 254016 | |
| Number of CLBs | 4704 | |
| Combinatorial Delay of a CLB-Max | 470 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | INDUSTRIAL | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 4704 CLBS, 254016 GATES | |
| Clock Frequency-Max | 357 MHz | |
| Supply Voltage-Max | 1.89 V | |
| Supply Voltage-Min | 1.71 V | |
| JESD-30 Code | S-PBGA-B900 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Peak Reflow Temperature (Cel) | 250 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 900 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 31 mm | |
| Length | 31 mm | |
| Seated Height-Max | 2.6 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | BGA, | |
| Pin Count | 900 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 | |
| ECCN Code | 3A991.D |
XCV812E-6FGG900I Datasheet Download
XCV812E-6FGG900I Overview
The chip model XCV812E-6FGG900I is a powerful and versatile processor that is suitable for a variety of applications, such as high-performance digital signal processing, embedded processing, and image processing. It requires the use of HDL language and is capable of meeting the needs of many industries.
In terms of industry trends, the chip model XCV812E-6FGG900I has the potential to revolutionize the way we process and store data. With its high-performance capabilities, it can help to reduce the cost of data processing, as well as increase the speed and accuracy of the process. In addition, its low power consumption makes it an ideal choice for a variety of applications.
When it comes to the application of the chip model XCV812E-6FGG900I in the development and popularization of future intelligent robots, the model could be used to help robots to process complex tasks and make decisions quickly and accurately. In order to use the model effectively, technical talents with knowledge of HDL language and related technologies are needed.
Overall, the chip model XCV812E-6FGG900I is an excellent choice for a variety of applications, and its potential for future development and application is vast. With its high-performance capabilities, low power consumption, and the potential to revolutionize the way we process and store data, it is sure to be a valuable asset for many industries in the future.
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Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| No reference price found. | ||