AMD Xilinx
XCV812E-6FGG900C
XCV812E-6FGG900C ECAD Model
XCV812E-6FGG900C Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 1.8 V | |
| Number of Equivalent Gates | 254016 | |
| Number of CLBs | 4704 | |
| Combinatorial Delay of a CLB-Max | 470 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | COMMERCIAL | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 4704 CLBS, 254016 GATES | |
| Clock Frequency-Max | 357 MHz | |
| Supply Voltage-Max | 1.89 V | |
| Supply Voltage-Min | 1.71 V | |
| JESD-30 Code | S-PBGA-B900 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 70 °C | |
| Peak Reflow Temperature (Cel) | 250 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 900 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 31 mm | |
| Length | 31 mm | |
| Seated Height-Max | 2.6 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | BGA, | |
| Pin Count | 900 | |
| Reach Compliance Code | compliant | |
| ECCN Code | 3A991.D | |
| HTS Code | 8542.39.00.01 |
XCV812E-6FGG900C Datasheet Download
XCV812E-6FGG900C Overview
The XCV812E-6FGG900C chip model is a powerful and reliable solution for high-performance digital signal processing, embedded processing, and image processing. This model is designed to work with HDL language, which offers a wide range of advantages for developers. It is also an ideal choice for those looking for a cost-effective solution for their projects.
The XCV812E-6FGG900C chip model offers a number of benefits for users, including its high performance, low power consumption, and its ability to support a wide range of applications. This makes it a great choice for those who need a reliable and cost-effective solution for their projects.
The demand for the XCV812E-6FGG900C chip model is expected to grow as more industries move towards the use of digital signal processing, embedded processing, and image processing. This model is ideal for applications in the automotive, medical, and industrial sectors, as well as in the consumer electronics industry.
The XCV812E-6FGG900C chip model is also likely to be used in the future in networks and intelligent scenarios. This model has the potential to be used in the era of fully intelligent systems, as it is capable of supporting a wide range of applications. It is also likely to be used in applications such as autonomous vehicles, smart home systems, and robotics.
Overall, the XCV812E-6FGG900C chip model is a great choice for those looking for a cost-effective solution for their projects. Its high performance, low power consumption, and its ability to support a wide range of applications make it an ideal choice for those who need a reliable and cost-effective solution for their projects. The demand for this model is expected to grow as more industries move towards the use of digital signal processing, embedded processing, and image processing. The XCV812E-6FGG900C chip model has the potential to be used in the era of fully intelligent systems, as it is capable of supporting a wide range of applications. This makes it a great choice for those looking for a reliable and cost-effective solution for their projects.
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| QTY | Unit Price | Ext Price |
|---|---|---|
| No reference price found. | ||