XCV812E-6FG900C

The XCV812E-6FG900C is a high-performance, low-power, field-programmable gate array (FPGA) chip. It is manufactured by Xilinx and is based on the Virtex-8 architecture.

The XCV812E-6FG900C has a total of 8,192 logic cells and 6,144 flip-flops. It has a total of 6,144 18-bit RAM blocks, and 6,144 18-bit distributed RAM blocks. It also features 36 DSP slices, and 28,672 digital signal processing (DSP) slices. It has a total of 4,096 18-bit multipliers and 4,096 18-bit adders. It also features four high-speed serial transceivers, two high-speed differential I/O banks, and two high-speed clock management tiles.

The XCV812E-6FG900C is suitable for a variety of applications, including high-performance embedded computing, digital signal processing, and communications. It is ideal for applications that require high-speed data processing, such as video and image processing, and high-speed communication systems. It is also suitable for applications that require low-power operation and low-cost implementation, such as consumer electronics and automotive systems.

The XCV812E-6FG900C is a powerful and versatile chip that is suitable for a variety of applications. It offers high performance, low power consumption, and low cost implementation. It is an ideal choice for applications that require high-speed data processing and high-speed communication systems.