AMD Xilinx
XCV812E-6BGG560I
XCV812E-6BGG560I ECAD Model
XCV812E-6BGG560I Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 1.8 V | |
| Number of Equivalent Gates | 254016 | |
| Number of CLBs | 4704 | |
| Combinatorial Delay of a CLB-Max | 470 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | INDUSTRIAL | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 4704 CLBS, 254016 GATES | |
| Clock Frequency-Max | 357 MHz | |
| Supply Voltage-Max | 1.89 V | |
| Supply Voltage-Min | 1.71 V | |
| JESD-30 Code | S-PBGA-B560 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Peak Reflow Temperature (Cel) | 260 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 560 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LBGA | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, LOW PROFILE | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1.27 mm | |
| Terminal Position | BOTTOM | |
| Width | 42.5 mm | |
| Length | 42.5 mm | |
| Seated Height-Max | 1.7 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | LBGA, | |
| Pin Count | 560 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 |
XCV812E-6BGG560I Datasheet Download
XCV812E-6BGG560I Overview
The chip model XCV812E-6BGG560I is a cutting-edge technology that has been developed to meet the growing demand for advanced communication systems. This model is designed to provide reliable performance and a high level of efficiency in the most demanding application environments. It is also capable of providing the necessary support for new technologies, such as the Internet of Things (IoT) and artificial intelligence (AI).
The XCV812E-6BGG560I chip model is designed to be highly efficient, with a low power consumption and a high speed. It is also capable of supporting various communication protocols, such as Wi-Fi, Bluetooth, and Ethernet, as well as providing support for advanced digital signal processing and encryption algorithms. In addition, the chip model is designed to be highly reliable, with a high level of protection against external interference and a wide range of temperature ranges.
The chip model is also designed to be highly upgradable, with the ability to be used in a variety of applications and scenarios. This includes applications in networks, such as the Internet of Things (IoT) and smart home systems, as well as applications in intelligent scenarios, such as autonomous vehicles and smart cities. As the technology advances, the XCV812E-6BGG560I chip model is also capable of being used in the era of fully intelligent systems, such as artificial intelligence (AI).
In conclusion, the XCV812E-6BGG560I chip model is a powerful and reliable technology that is designed to provide reliable performance and a high level of efficiency in the most demanding application environments. It is also capable of supporting various communication protocols, providing support for advanced digital signal processing and encryption algorithms, and being used in a variety of applications and scenarios. Therefore, the chip model is suitable for use in both current and future applications and is capable of being used in the era of fully intelligent systems.
You May Also Be Interested In
4,304 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $937.4400 | $937.4400 |
| 10+ | $927.3600 | $9,273.6000 |
| 100+ | $876.9600 | $87,696.0000 |
| 1000+ | $826.5600 | $413,280.0000 |
| 10000+ | $756.0000 | $756,000.0000 |
| The price is for reference only, please refer to the actual quotation! | ||