AMD Xilinx
XCV812E-6BGG560C
XCV812E-6BGG560C ECAD Model
XCV812E-6BGG560C Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 1.8 V | |
| Number of Equivalent Gates | 254016 | |
| Number of CLBs | 4704 | |
| Combinatorial Delay of a CLB-Max | 470 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | COMMERCIAL | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 4704 CLBS, 254016 GATES | |
| Clock Frequency-Max | 357 MHz | |
| Supply Voltage-Max | 1.89 V | |
| Supply Voltage-Min | 1.71 V | |
| JESD-30 Code | S-PBGA-B560 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 70 °C | |
| Peak Reflow Temperature (Cel) | 260 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 560 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LBGA | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, LOW PROFILE | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1.27 mm | |
| Terminal Position | BOTTOM | |
| Width | 42.5 mm | |
| Length | 42.5 mm | |
| Seated Height-Max | 1.7 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | LBGA, | |
| Pin Count | 560 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 |
XCV812E-6BGG560C Datasheet Download
XCV812E-6BGG560C Overview
The chip model XCV812E-6BGG560C is a state-of-the-art integrated circuit with advanced features and performance capabilities. It is designed to meet the needs of the most demanding applications and to provide the highest level of reliability and performance. It is a versatile chip with a wide range of applications and is suitable for a variety of communication systems.
The XCV812E-6BGG560C is a cutting-edge chip that has been designed to support the latest technologies and trends in the industry. It is capable of supporting the newest communication protocols, such as 5G, and is designed to meet the ever-evolving needs of the modern world. It is also designed to be able to handle the increasing demand for data transfer speeds, and can easily handle the bandwidth needs of the most advanced communication systems.
The XCV812E-6BGG560C can be used in a variety of applications, including networks, intelligent systems, and even in the era of fully intelligent systems. It is capable of supporting the most advanced communication protocols and is designed to provide the highest level of reliability and performance. Additionally, it is designed to be upgradeable and can be easily adapted to future trends and technologies. This makes it a great choice for those who are looking for a chip that can keep up with the ever-changing needs of the industry.
The XCV812E-6BGG560C is a powerful chip that has the potential to revolutionize the industry. It is capable of supporting the latest communication protocols, such as 5G, and is designed to meet the ever-evolving needs of the modern world. It is also designed to be upgradeable and can be easily adapted to future trends and technologies. This makes it a great choice for those who are looking for a chip that can keep up with the ever-changing needs of the industry. Additionally, it is capable of supporting a variety of applications, including networks, intelligent systems, and even in the era of fully intelligent systems. This makes it a great choice for those who are looking to take advantage of the latest technology.
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2,835 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $937.4400 | $937.4400 |
| 10+ | $927.3600 | $9,273.6000 |
| 100+ | $876.9600 | $87,696.0000 |
| 1000+ | $826.5600 | $413,280.0000 |
| 10000+ | $756.0000 | $756,000.0000 |
| The price is for reference only, please refer to the actual quotation! | ||