AMD Xilinx
XCV812E-6BG560I
XCV812E-6BG560I ECAD Model
XCV812E-6BG560I Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 1.8 V | |
| Number of Inputs | 404 | |
| Number of Outputs | 404 | |
| Number of Logic Cells | 21168 | |
| Number of Equivalent Gates | 254016 | |
| Number of CLBs | 4704 | |
| Combinatorial Delay of a CLB-Max | 470 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | INDUSTRIAL | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 4704 CLBS, 254016 GATES | |
| Clock Frequency-Max | 357 MHz | |
| Power Supplies | 1.2/3.6,1.8 V | |
| Supply Voltage-Max | 1.89 V | |
| Supply Voltage-Min | 1.71 V | |
| JESD-30 Code | S-PBGA-B560 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Peak Reflow Temperature (Cel) | 225 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 560 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LBGA | |
| Package Equivalence Code | BGA560,33X33,50 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, LOW PROFILE | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Lead (Sn63Pb37) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1.27 mm | |
| Terminal Position | BOTTOM | |
| Width | 42.5 mm | |
| Length | 42.5 mm | |
| Seated Height-Max | 1.7 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | PLASTIC, BGA-560 | |
| Pin Count | 560 | |
| Reach Compliance Code | not_compliant | |
| HTS Code | 8542.39.00.01 | |
| ECCN Code | 3A991.D |
XCV812E-6BG560I Datasheet Download
XCV812E-6BG560I Overview
The chip model XCV812E-6BG560I has been developed to meet the need for high-performance digital signal processing, embedded processing, and image processing. It requires the use of HDL language, and is suitable for a wide range of applications and industries.
The XCV812E-6BG560I is a high-performance chip model that can be used to process digital signals and images. It is designed to be compatible with a wide range of applications and industries, and is capable of providing reliable performance in demanding environments. It is also equipped with a variety of features, such as low power consumption, high speed processing, and a high degree of scalability.
In terms of industry trends, the XCV812E-6BG560I is expected to be widely used in a variety of industries, such as automotive, telecommunications, and consumer electronics. As technology continues to advance, the XCV812E-6BG560I is expected to be used in more advanced applications, such as 5G networks, artificial intelligence, and robotics.
The original design intention of the XCV812E-6BG560I was to provide a reliable, high-performance solution for digital signal processing, embedded processing, and image processing. The chip model is designed to be scalable and upgradeable, so it can be used in more advanced applications and communication systems. As such, it can be used in a wide range of industries, from consumer electronics to telecommunications.
In terms of future upgrades, the XCV812E-6BG560I is expected to become even more powerful, with increased processing speed and improved power efficiency. It is also likely to be compatible with new technologies, such as 5G networks, artificial intelligence, and robotics. This will allow the chip model to be used in more advanced applications and communication systems, such as self-driving cars and smart homes.
Overall, the chip model XCV812E-6BG560I is a powerful, reliable, and upgradeable solution for digital signal processing, embedded processing, and image processing. It is expected to be widely used in a variety of industries, and is capable of providing reliable performance in demanding environments. With its scalability and upgradeability, it can be used in more advanced applications and communication systems, such as 5G networks, artificial intelligence, and robotics.
You May Also Be Interested In
3,156 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $937.4400 | $937.4400 |
| 10+ | $927.3600 | $9,273.6000 |
| 100+ | $876.9600 | $87,696.0000 |
| 1000+ | $826.5600 | $413,280.0000 |
| 10000+ | $756.0000 | $756,000.0000 |
| The price is for reference only, please refer to the actual quotation! | ||