AMD Xilinx
XCV800-6FGG680C
XCV800-6FGG680C ECAD Model
XCV800-6FGG680C Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 2.5 V | |
| Number of Equivalent Gates | 888439 | |
| Number of CLBs | 4704 | |
| Combinatorial Delay of a CLB-Max | 600 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 4704 CLBS, 888439 GATES | |
| Clock Frequency-Max | 333 MHz | |
| Supply Voltage-Max | 2.625 V | |
| Supply Voltage-Min | 2.375 V | |
| JESD-30 Code | S-PBGA-B680 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | 260 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 680 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LBGA | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, LOW PROFILE | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 40 mm | |
| Length | 40 mm | |
| Seated Height-Max | 1.7 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | LBGA, | |
| Pin Count | 680 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 |
XCV800-6FGG680C Datasheet Download
XCV800-6FGG680C Overview
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The product description of the XCV800-6FGG680C chip model includes a range of features that make it a great choice for many different applications. It is capable of handling a wide range of tasks, from basic data processing to advanced communication systems. Its design has been optimized for maximum performance and efficiency, allowing for a wide range of usage scenarios. It is also capable of running a variety of operating systems, making it a great choice for many different applications.
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Case studies have shown that the XCV800-6FGG680C chip model is a reliable and efficient solution for many different applications. It is capable of handling a wide range of tasks, from basic data processing to advanced communication systems. Its design has been optimized for maximum performance and efficiency, allowing for a wide range of usage scenarios. It is also capable of running a variety of operating systems, making it a great choice for many different applications.
When using the XCV800-6FGG680C chip model, it is important to keep in mind that it is a highly advanced and complex piece of technology. It is important to ensure that the chip model is installed correctly and that all necessary precautions are taken. This includes making sure that all necessary drivers are installed and that the chip model is properly configured. It is also important to ensure that the chip model is compatible with any peripheral devices that are being used.
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