AMD Xilinx
XCV800-6FGG676C
XCV800-6FGG676C ECAD Model
XCV800-6FGG676C Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 2.5 V | |
| Number of Equivalent Gates | 888439 | |
| Number of CLBs | 4704 | |
| Combinatorial Delay of a CLB-Max | 600 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 4704 CLBS, 888439 GATES | |
| Clock Frequency-Max | 333 MHz | |
| Supply Voltage-Max | 2.625 V | |
| Supply Voltage-Min | 2.375 V | |
| JESD-30 Code | S-PBGA-B676 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | 250 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 676 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 27 mm | |
| Length | 27 mm | |
| Seated Height-Max | 2.6 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | BGA, | |
| Pin Count | 676 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 |
XCV800-6FGG676C Datasheet Download
XCV800-6FGG676C Overview
The XCV800-6FGG676C chip model is a high-performance digital signal processing, embedded processing, and image processing chip model. It is designed to meet the needs of various industries, such as the Internet of Things, smart cities, and industrial automation. The chip model is equipped with a high-performance processor, memory, and other components, and supports the use of HDL language.
The XCV800-6FGG676C chip model has many advantages, making it suitable for a wide range of applications. It has a high performance-to-power ratio, making it ideal for applications that require high performance but have limited power consumption. It also has a low latency, making it suitable for applications that require fast response times. Additionally, it is highly scalable, making it suitable for applications that require the flexibility to scale up or down as needed.
The demand for the XCV800-6FGG676C chip model is expected to increase in the future as more and more industries adopt the technology. This is due to the increasing need for high-performance, low-power, and low-latency solutions for various applications. Additionally, the scalability of the chip model makes it suitable for applications that require the flexibility to scale up or down as needed.
The original design intention of the XCV800-6FGG676C chip model was to provide a high-performance, low-power, and low-latency solution for various industries. It was designed to meet the needs of various industries, such as the Internet of Things, smart cities, and industrial automation. The chip model is equipped with a high-performance processor, memory, and other components, and supports the use of HDL language.
The XCV800-6FGG676C chip model can be upgraded in the future to meet the needs of advanced communication systems. The chip model is highly scalable, making it suitable for applications that require the flexibility to scale up or down as needed. Additionally, the chip model is equipped with a high-performance processor, memory, and other components, making it suitable for applications that require high-performance solutions.
The XCV800-6FGG676C chip model is a powerful solution for various industries, and its future upgrades make it suitable for advanced communication systems. With its high performance-to-power ratio, low latency, and scalability, the chip model is sure to be a popular choice for many applications in the future.
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