AMD Xilinx
XCV800-6FG676I
XCV800-6FG676I ECAD Model
XCV800-6FG676I Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 2.5 V | |
| Number of Inputs | 444 | |
| Number of Outputs | 444 | |
| Number of Logic Cells | 21168 | |
| Number of Equivalent Gates | 888439 | |
| Number of CLBs | 4704 | |
| Combinatorial Delay of a CLB-Max | 600 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 4704 CLBS, 888439 GATES | |
| Clock Frequency-Max | 333 MHz | |
| Power Supplies | 1.2/3.6,2.5 V | |
| Supply Voltage-Max | 2.625 V | |
| Supply Voltage-Min | 2.375 V | |
| JESD-30 Code | S-PBGA-B676 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Peak Reflow Temperature (Cel) | 225 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 676 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA676,26X26,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Lead (Sn63Pb37) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 27 mm | |
| Length | 27 mm | |
| Seated Height-Max | 2.6 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | FBGA-676 | |
| Pin Count | 676 | |
| Reach Compliance Code | not_compliant | |
| HTS Code | 8542.39.00.01 |
XCV800-6FG676I Datasheet Download
XCV800-6FG676I Overview
The XCV800-6FG676I chip model is a powerful and versatile model that is suitable for a variety of applications and scenarios. It is designed to provide high-performance digital signal processing, embedded processing, and image processing capabilities. To use this model, the user must be familiar with the HDL language.
The original design intention of the XCV800-6FG676I chip model was to provide a powerful and versatile platform for a variety of applications. It was designed to be easily upgradable and expandable, allowing users to add new features and capabilities as needed. This makes it suitable for use in a variety of applications and scenarios, including high-performance digital signal processing, embedded processing, and image processing.
The XCV800-6FG676I chip model can also be applied to advanced communication systems. It is capable of providing reliable communication between various devices, allowing for the transmission of data and information over long distances. Furthermore, it can be used for intelligent scenarios, such as automated decision making, natural language processing, and machine learning. This makes the XCV800-6FG676I chip model suitable for use in the era of fully intelligent systems.
In addition, the XCV800-6FG676I chip model can be applied to networks. It is capable of providing reliable and secure communication between multiple devices, allowing for the transmission of data and information over long distances. Furthermore, it can be used for intelligent scenarios, such as automated decision making, natural language processing, and machine learning. This makes the XCV800-6FG676I chip model suitable for use in networks and the era of fully intelligent systems.
Overall, the XCV800-6FG676I chip model is a powerful and versatile model that is suitable for a variety of applications and scenarios. It is designed to provide high-performance digital signal processing, embedded processing, and image processing capabilities. It is also capable of providing reliable communication between various devices, allowing for the transmission of data and information over long distances. Furthermore, it can be used for intelligent scenarios, such as automated decision making, natural language processing, and machine learning. This makes the XCV800-6FG676I chip model suitable for use in networks and the era of fully intelligent systems.
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