XCV800-6BGG560I
XCV800-6BGG560I
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rohs

AMD Xilinx

XCV800-6BGG560I


XCV800-6BGG560I
F20-XCV800-6BGG560I
Active
FIELD PROGRAMMABLE GATE ARRAY, CMOS, LBGA
LBGA

XCV800-6BGG560I ECAD Model


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XCV800-6BGG560I Attributes


Type Description Select
Pbfree Code Yes
Rohs Code Yes
Part Life Cycle Code Obsolete
Supply Voltage-Nom 2.5 V
Number of Equivalent Gates 888439
Number of CLBs 4704
Combinatorial Delay of a CLB-Max 600 ps
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Package Shape SQUARE
Technology CMOS
Organization 4704 CLBS, 888439 GATES
Clock Frequency-Max 333 MHz
Supply Voltage-Max 2.625 V
Supply Voltage-Min 2.375 V
JESD-30 Code S-PBGA-B560
Qualification Status Not Qualified
JESD-609 Code e1
Moisture Sensitivity Level 3
Peak Reflow Temperature (Cel) 260
Time@Peak Reflow Temperature-Max (s) 30
Number of Terminals 560
Package Body Material PLASTIC/EPOXY
Package Code LBGA
Package Shape SQUARE
Package Style GRID ARRAY, LOW PROFILE
Surface Mount YES
Terminal Finish TIN SILVER COPPER
Terminal Form BALL
Terminal Pitch 1.27 mm
Terminal Position BOTTOM
Width 42.5 mm
Length 42.5 mm
Seated Height-Max 1.7 mm
Ihs Manufacturer XILINX INC
Part Package Code BGA
Package Description LBGA,
Pin Count 560
Reach Compliance Code compliant
HTS Code 8542.39.00.01

XCV800-6BGG560I Datasheet Download


XCV800-6BGG560I Overview



The XCV800-6BGG560I chip model is a powerful and efficient digital signal processing solution designed for a wide range of applications. It is suitable for high-performance digital signal processing, embedded processing and image processing, and requires the use of HDL language.


The XCV800-6BGG560I chip model is designed to provide high performance and low power consumption for digital signal processing applications. It offers a variety of features, including a high-speed data transfer rate, low latency, and a wide range of instruction sets. The chip also has a large amount of on-chip memory, allowing for efficient data storage and retrieval.


The XCV800-6BGG560I chip model is designed to be flexible and easy to use. It is highly compatible with a variety of development tools and platforms, making it easy to integrate into existing systems. Additionally, the chip includes a variety of advanced features, such as a built-in debug system and support for multiple operating systems. This makes it an ideal solution for a wide range of applications.


The XCV800-6BGG560I chip model is expected to be in high demand in the future, as more and more applications require high-performance digital signal processing. The chip is well suited for a variety of applications, including embedded systems, image processing, and high-performance computing.


The original design intention of the XCV800-6BGG560I chip model was to provide a powerful and efficient solution for digital signal processing. The chip is designed to be highly flexible and easy to use, and is compatible with a variety of development tools and platforms. Additionally, the chip includes advanced features, such as a built-in debug system and support for multiple operating systems.


The XCV800-6BGG560I chip model is capable of being upgraded in the future. The chip is designed to be highly flexible and can be adapted to new technologies and applications as needed. Additionally, the chip includes advanced features, such as a built-in debug system and support for multiple operating systems, which make it an ideal solution for a wide range of applications.


The XCV800-6BGG560I chip model is also suitable for use in advanced communication systems. The chip is well suited for a variety of applications, including embedded systems, image processing, and high-performance computing. Additionally, the chip includes advanced features, such as a built-in debug system and support for multiple operating systems, which make it an ideal solution for a wide range of applications.



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1+ $279.0000 $279.0000
10+ $276.0000 $2,760.0000
100+ $261.0000 $26,100.0000
1000+ $246.0000 $123,000.0000
10000+ $225.0000 $225,000.0000
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