
AMD Xilinx
XCV800-6BGG560C
XCV800-6BGG560C ECAD Model
XCV800-6BGG560C Attributes
Type | Description | Select |
---|---|---|
Pbfree Code | Yes | |
Rohs Code | Yes | |
Part Life Cycle Code | Obsolete | |
Supply Voltage-Nom | 2.5 V | |
Number of Equivalent Gates | 888439 | |
Number of CLBs | 4704 | |
Combinatorial Delay of a CLB-Max | 600 ps | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Temperature Grade | OTHER | |
Package Shape | SQUARE | |
Technology | CMOS | |
Organization | 4704 CLBS, 888439 GATES | |
Clock Frequency-Max | 333 MHz | |
Supply Voltage-Max | 2.625 V | |
Supply Voltage-Min | 2.375 V | |
JESD-30 Code | S-PBGA-B560 | |
Qualification Status | Not Qualified | |
JESD-609 Code | e1 | |
Moisture Sensitivity Level | 3 | |
Operating Temperature-Max | 85 °C | |
Peak Reflow Temperature (Cel) | 260 | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Number of Terminals | 560 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | LBGA | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY, LOW PROFILE | |
Surface Mount | YES | |
Terminal Finish | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | |
Terminal Form | BALL | |
Terminal Pitch | 1.27 mm | |
Terminal Position | BOTTOM | |
Width | 42.5 mm | |
Length | 42.5 mm | |
Seated Height-Max | 1.7 mm | |
Ihs Manufacturer | XILINX INC | |
Part Package Code | BGA | |
Package Description | LBGA, | |
Pin Count | 560 | |
Reach Compliance Code | compliant | |
HTS Code | 8542.39.00.01 |
XCV800-6BGG560C Datasheet Download
XCV800-6BGG560C Overview
The chip model XCV800-6BGG560C has become a popular choice for many industries due to its advanced features and capabilities. It is a powerful chip that has the potential to revolutionize the way we use technology and has a wide range of applications.
In terms of industry trends, the chip model XCV800-6BGG560C has been used in a variety of industries, including communications, automotive, consumer electronics, and industrial automation. It is expected that the chip will continue to be used in more industries in the future, as new technologies continue to be developed.
The chip model XCV800-6BGG560C is also expected to be used in the development of future intelligent networks and robots. It is capable of handling a wide range of tasks, from complex calculations to data processing. It is also capable of recognizing patterns and making decisions based on its own algorithms. This makes it an ideal choice for the development of intelligent networks and robots.
The chip model XCV800-6BGG560C is also expected to be used in the development of future intelligent robots. It is capable of understanding and responding to its environment, as well as being able to learn from its experiences. It is also capable of recognizing patterns and making decisions based on its own algorithms. This makes it an ideal choice for the development of intelligent robots.
In order to use the chip model XCV800-6BGG560C effectively, it is important to have the right technical talents. This includes knowledge of programming languages, such as C++ and Python, as well as knowledge of robotics and artificial intelligence. It is also important to have a good understanding of the chip model itself, as well as the various applications it can be used for.
In conclusion, the chip model XCV800-6BGG560C is an advanced and powerful chip that has the potential to revolutionize the way we use technology. It has a wide range of applications and is expected to be used in more industries in the future, as new technologies continue to be developed. It is also expected to be used in the development of future intelligent networks and robots, and the right technical talents are needed to use the model effectively.
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2,493 In Stock






Pricing (USD)
QTY | Unit Price | Ext Price |
---|---|---|
1+ | $279.0000 | $279.0000 |
10+ | $276.0000 | $2,760.0000 |
100+ | $261.0000 | $26,100.0000 |
1000+ | $246.0000 | $123,000.0000 |
10000+ | $225.0000 | $225,000.0000 |
The price is for reference only, please refer to the actual quotation! |