XCV800-6BGG560C
XCV800-6BGG560C
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rohs

AMD Xilinx

XCV800-6BGG560C


XCV800-6BGG560C
F20-XCV800-6BGG560C
Active
FIELD PROGRAMMABLE GATE ARRAY, CMOS, LBGA
LBGA

XCV800-6BGG560C ECAD Model


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XCV800-6BGG560C Attributes


Type Description Select
Pbfree Code Yes
Rohs Code Yes
Part Life Cycle Code Obsolete
Supply Voltage-Nom 2.5 V
Number of Equivalent Gates 888439
Number of CLBs 4704
Combinatorial Delay of a CLB-Max 600 ps
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Temperature Grade OTHER
Package Shape SQUARE
Technology CMOS
Organization 4704 CLBS, 888439 GATES
Clock Frequency-Max 333 MHz
Supply Voltage-Max 2.625 V
Supply Voltage-Min 2.375 V
JESD-30 Code S-PBGA-B560
Qualification Status Not Qualified
JESD-609 Code e1
Moisture Sensitivity Level 3
Operating Temperature-Max 85 °C
Peak Reflow Temperature (Cel) 260
Time@Peak Reflow Temperature-Max (s) 30
Number of Terminals 560
Package Body Material PLASTIC/EPOXY
Package Code LBGA
Package Shape SQUARE
Package Style GRID ARRAY, LOW PROFILE
Surface Mount YES
Terminal Finish Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)
Terminal Form BALL
Terminal Pitch 1.27 mm
Terminal Position BOTTOM
Width 42.5 mm
Length 42.5 mm
Seated Height-Max 1.7 mm
Ihs Manufacturer XILINX INC
Part Package Code BGA
Package Description LBGA,
Pin Count 560
Reach Compliance Code compliant
HTS Code 8542.39.00.01

XCV800-6BGG560C Datasheet Download


XCV800-6BGG560C Overview



The chip model XCV800-6BGG560C has become a popular choice for many industries due to its advanced features and capabilities. It is a powerful chip that has the potential to revolutionize the way we use technology and has a wide range of applications.


In terms of industry trends, the chip model XCV800-6BGG560C has been used in a variety of industries, including communications, automotive, consumer electronics, and industrial automation. It is expected that the chip will continue to be used in more industries in the future, as new technologies continue to be developed.


The chip model XCV800-6BGG560C is also expected to be used in the development of future intelligent networks and robots. It is capable of handling a wide range of tasks, from complex calculations to data processing. It is also capable of recognizing patterns and making decisions based on its own algorithms. This makes it an ideal choice for the development of intelligent networks and robots.


The chip model XCV800-6BGG560C is also expected to be used in the development of future intelligent robots. It is capable of understanding and responding to its environment, as well as being able to learn from its experiences. It is also capable of recognizing patterns and making decisions based on its own algorithms. This makes it an ideal choice for the development of intelligent robots.


In order to use the chip model XCV800-6BGG560C effectively, it is important to have the right technical talents. This includes knowledge of programming languages, such as C++ and Python, as well as knowledge of robotics and artificial intelligence. It is also important to have a good understanding of the chip model itself, as well as the various applications it can be used for.


In conclusion, the chip model XCV800-6BGG560C is an advanced and powerful chip that has the potential to revolutionize the way we use technology. It has a wide range of applications and is expected to be used in more industries in the future, as new technologies continue to be developed. It is also expected to be used in the development of future intelligent networks and robots, and the right technical talents are needed to use the model effectively.



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1+ $279.0000 $279.0000
10+ $276.0000 $2,760.0000
100+ $261.0000 $26,100.0000
1000+ $246.0000 $123,000.0000
10000+ $225.0000 $225,000.0000
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