AMD Xilinx
XCV800-6BGG432C
XCV800-6BGG432C ECAD Model
XCV800-6BGG432C Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 2.5 V | |
| Number of Equivalent Gates | 888439 | |
| Number of CLBs | 4704 | |
| Combinatorial Delay of a CLB-Max | 600 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 4704 CLBS, 888439 GATES | |
| Clock Frequency-Max | 333 MHz | |
| Supply Voltage-Max | 2.625 V | |
| Supply Voltage-Min | 2.375 V | |
| JESD-30 Code | S-PBGA-B432 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | 260 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 432 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LBGA | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, LOW PROFILE | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1.27 mm | |
| Terminal Position | BOTTOM | |
| Width | 40 mm | |
| Length | 40 mm | |
| Seated Height-Max | 1.7 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | LBGA, | |
| Pin Count | 432 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 |
XCV800-6BGG432C Datasheet Download
XCV800-6BGG432C Overview
The XCV800-6BGG432C chip model is a state-of-the-art microprocessor designed for high-performance digital signal processing, embedded processing, and image processing. It is a powerful tool for embedded system designers, allowing them to create highly efficient and reliable systems. This chip model is designed to use the HDL (Hardware Description Language) which is a powerful and efficient language for programming digital logic.
The XCV800-6BGG432C chip model offers many advantages compared to existing solutions. It is designed with a high-performance architecture that allows for more efficient operation and better performance. It also has a low power consumption, making it a great choice for embedded applications. Additionally, the chip model is designed to be easily upgradable, allowing for future upgrades to be made with relative ease.
The XCV800-6BGG432C chip model is expected to be in high demand in the future, as the need for high-performance embedded systems continues to grow. This chip model is an excellent choice for system designers looking for a reliable, high-performance solution. Additionally, the chip model is well-suited for advanced communication systems, as it is designed with the latest technology and can be easily upgraded.
The original design intention of the XCV800-6BGG432C chip model was to create a powerful, reliable, and upgradable microprocessor for embedded systems. The design team sought to create a chip model that could be used in a variety of applications and could be upgraded easily. The chip model is a great example of modern engineering, as it is designed with the latest technology and can be easily upgraded to future versions.
In conclusion, the XCV800-6BGG432C chip model is a powerful and reliable microprocessor designed for high-performance digital signal processing, embedded processing, and image processing. It is a great choice for system designers looking for a reliable, high-performance solution and is well-suited for advanced communication systems. The chip model is designed with the latest technology and can be easily upgraded, making it a great choice for embedded applications.
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Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $265.6080 | $265.6080 |
| 10+ | $262.7520 | $2,627.5200 |
| 100+ | $248.4720 | $24,847.2000 |
| 1000+ | $234.1920 | $117,096.0000 |
| 10000+ | $214.2000 | $214,200.0000 |
| The price is for reference only, please refer to the actual quotation! | ||