AMD Xilinx
XCV800-5FGG676I
XCV800-5FGG676I ECAD Model
XCV800-5FGG676I Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 2.5 V | |
| Number of Equivalent Gates | 888439 | |
| Number of CLBs | 4704 | |
| Combinatorial Delay of a CLB-Max | 700 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 4704 CLBS, 888439 GATES | |
| Clock Frequency-Max | 294 MHz | |
| Supply Voltage-Max | 2.625 V | |
| Supply Voltage-Min | 2.375 V | |
| JESD-30 Code | S-PBGA-B676 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 3 | |
| Peak Reflow Temperature (Cel) | 250 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 676 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 27 mm | |
| Length | 27 mm | |
| Seated Height-Max | 2.6 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | BGA, | |
| Pin Count | 676 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 |
XCV800-5FGG676I Datasheet Download
XCV800-5FGG676I Overview
The XCV800-5FGG676I chip model is a powerful and versatile processor that is well-suited to a variety of high-performance digital signal processing, embedded processing, and image processing applications. This model is designed to be programmed using the HDL (Hardware Description Language) language, which is an important language for developing and debugging complex digital systems.
The XCV800-5FGG676I chip model offers several advantages over traditional processors, including better performance, lower power consumption, and improved scalability. Furthermore, the model is designed to be highly flexible in order to accommodate a variety of applications. This makes the XCV800-5FGG676I an ideal choice for a range of industries, including consumer electronics, automotive, and medical.
As demand for intelligent robots increases in the future, the XCV800-5FGG676I chip model could be applied to the development and popularization of these robots. This model is capable of performing complex tasks, such as speech recognition and natural language processing, which are essential for the development of sophisticated robots. In order to use the XCV800-5FGG676I chip model effectively, technical talents such as software engineers, electrical engineers, and computer scientists are needed. These professionals must have a strong understanding of the HDL language and be able to program the model to perform specific tasks.
Overall, the XCV800-5FGG676I chip model is a powerful and versatile processor that is well-suited to a variety of high-performance digital signal processing, embedded processing, and image processing applications. This model has the potential to be applied to the development and popularization of intelligent robots in the future, and technical talents such as software engineers, electrical engineers, and computer scientists are needed to use the model effectively.
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| QTY | Unit Price | Ext Price |
|---|---|---|
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