AMD Xilinx
XCV800-5BGG560C
XCV800-5BGG560C ECAD Model
XCV800-5BGG560C Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 2.5 V | |
| Number of Equivalent Gates | 888439 | |
| Number of CLBs | 4704 | |
| Combinatorial Delay of a CLB-Max | 700 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 4704 CLBS, 888439 GATES | |
| Clock Frequency-Max | 294 MHz | |
| Supply Voltage-Max | 2.625 V | |
| Supply Voltage-Min | 2.375 V | |
| JESD-30 Code | S-PBGA-B560 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | 260 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 560 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LBGA | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, LOW PROFILE | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1.27 mm | |
| Terminal Position | BOTTOM | |
| Width | 42.5 mm | |
| Length | 42.5 mm | |
| Seated Height-Max | 1.7 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | LBGA, | |
| Pin Count | 560 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 |
XCV800-5BGG560C Datasheet Download
XCV800-5BGG560C Overview
The XCV800-5BGG560C chip model is an advanced and powerful model that is suitable for high-performance digital signal processing, embedded processing, and image processing. It is designed to be used with HDL language, which is a hardware description language used for designing and simulating digital systems. The chip model has several advantages that make it stand out from other models. It is able to process large amounts of data quickly and accurately, and its power consumption is relatively low.
The XCV800-5BGG560C chip model is expected to be in high demand in the future due to its versatility and performance. It is expected to be used in a wide range of industries, from automotive to healthcare. It is also expected to be used in network applications, such as 5G and other high-speed networks. It can be used to create intelligent systems that can process large amounts of data quickly and accurately. It can also be used in the era of fully intelligent systems, such as autonomous vehicles and other smart systems.
The XCV800-5BGG560C chip model is a powerful and versatile model that is suitable for a wide range of applications. It has several advantages that make it stand out from other models, and it is expected to be in high demand in the future. It can be used in network applications and intelligent systems, and it can also be used in the era of fully intelligent systems. With its advanced features and capabilities, the XCV800-5BGG560C chip model is sure to be an important part of the future of digital signal processing, embedded processing, and image processing.
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1,782 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $1,236.3792 | $1,236.3792 |
| 10+ | $1,223.0848 | $12,230.8480 |
| 100+ | $1,156.6128 | $115,661.2800 |
| 1000+ | $1,090.1408 | $545,070.4000 |
| 10000+ | $997.0800 | $997,080.0000 |
| The price is for reference only, please refer to the actual quotation! | ||