AMD Xilinx
XCV800-4FGG680I
XCV800-4FGG680I ECAD Model
XCV800-4FGG680I Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 2.5 V | |
| Number of Equivalent Gates | 888439 | |
| Number of CLBs | 4704 | |
| Combinatorial Delay of a CLB-Max | 800 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 4704 CLBS, 888439 GATES | |
| Clock Frequency-Max | 250 MHz | |
| Supply Voltage-Max | 2.625 V | |
| Supply Voltage-Min | 2.375 V | |
| JESD-30 Code | S-PBGA-B680 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 3 | |
| Peak Reflow Temperature (Cel) | 260 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 680 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LBGA | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, LOW PROFILE | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 40 mm | |
| Length | 40 mm | |
| Seated Height-Max | 1.7 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | LBGA, | |
| Pin Count | 680 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 |
XCV800-4FGG680I Datasheet Download
XCV800-4FGG680I Overview
The XCV800-4FGG680I is a highly advanced chip model that has become increasingly popular in the industry. It is a powerful and reliable chip model that provides a wide range of features and benefits. It is designed to be a cost-effective solution for a variety of applications.
The XCV800-4FGG680I is an advanced chip model that offers a range of features and benefits. It is capable of handling a wide range of tasks, from simple data processing to complex calculations. The chip model is also highly efficient, making it an ideal choice for businesses and organizations that need to reduce costs.
The XCV800-4FGG680I is a versatile chip model that can be used in a variety of industries. It can be used for data processing, network communications, and other applications. It is also capable of supporting a wide range of technologies, including those related to artificial intelligence and the Internet of Things.
The XCV800-4FGG680I is a powerful chip model that is expected to be in high demand in the future. It is expected to be used in a variety of industries, including telecommunications, automotive, and medical. It is also expected to be used in the era of fully intelligent systems, as it is capable of supporting a wide range of technologies.
The XCV800-4FGG680I is an advanced chip model that can be used in a variety of networks and intelligent scenarios. It is capable of supporting a wide range of technologies, including those related to artificial intelligence and the Internet of Things. It is also capable of providing a cost-effective solution for businesses and organizations that need to reduce costs.
In conclusion, the XCV800-4FGG680I is a powerful and reliable chip model that can be used in a variety of industries and applications. It is capable of supporting a wide range of technologies, including those related to artificial intelligence and the Internet of Things. It is expected to be in high demand in the future, as it is capable of providing a cost-effective solution for businesses and organizations that need to reduce costs. As such, it is likely that the industry trends of the chip model XCV800-4FGG680I and the future development of related industries will depend on what specific technologies are needed.
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