AMD Xilinx
XCV800-4FGG680C
XCV800-4FGG680C ECAD Model
XCV800-4FGG680C Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 2.5 V | |
| Number of Equivalent Gates | 888439 | |
| Number of CLBs | 4704 | |
| Combinatorial Delay of a CLB-Max | 800 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 4704 CLBS, 888439 GATES | |
| Clock Frequency-Max | 250 MHz | |
| Supply Voltage-Max | 2.625 V | |
| Supply Voltage-Min | 2.375 V | |
| JESD-30 Code | S-PBGA-B680 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | 260 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 680 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LBGA | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, LOW PROFILE | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 40 mm | |
| Length | 40 mm | |
| Seated Height-Max | 1.7 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | LBGA, | |
| Pin Count | 680 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 |
XCV800-4FGG680C Datasheet Download
XCV800-4FGG680C Overview
XCV800-4FGG680C is a powerful chip model developed for high-performance digital signal processing, embedded processing, and image processing. It is designed to be used with HDL (Hardware Description Language), allowing users to write code that can be used to create complex digital systems. The chip is capable of executing complex algorithms and can be used to build a wide range of applications.
The XCV800-4FGG680C chip model offers several advantages over other chip models. It is designed to be highly reliable, with a low failure rate, and it is capable of running complex algorithms quickly and efficiently. It is also designed to be cost-effective, allowing users to save money while still getting the best performance. Additionally, the chip model is designed to be compatible with a wide range of development environments, making it easy to use and integrate into existing systems.
The XCV800-4FGG680C chip model is expected to be in high demand in the near future. More and more businesses and organizations are turning to digital signal processing, embedded processing, and image processing as a way to increase their efficiency and reduce their costs. As a result, the XCV800-4FGG680C chip model is expected to be a popular choice for these applications.
In order to use the XCV800-4FGG680C chip model effectively, users must understand the product description and design requirements. The chip model requires users to understand the principles of HDL and how to write code that can be used to create complex digital systems. Additionally, users must be aware of the specific design requirements of the chip model, such as the memory and clock speed requirements.
In order to ensure successful implementation of the XCV800-4FGG680C chip model, users should consider actual case studies and follow any precautions that are recommended. For example, users should be aware of the potential risks associated with using the chip model, such as the potential for data loss or system failure. Additionally, users should be aware of any potential compatibility issues with existing systems and should take steps to ensure that the chip model is compatible with their existing systems.
Overall, the XCV800-4FGG680C chip model is a powerful and reliable chip model that is designed for high-performance digital signal processing, embedded processing, and image processing. It is expected to be in high demand in the near future and users must understand the product description and design requirements in order to use it effectively. By following the recommended precautions and considering actual case studies, users can ensure successful implementation of the chip model.
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