AMD Xilinx
XCV800-4BGG560I
XCV800-4BGG560I ECAD Model
XCV800-4BGG560I Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 2.5 V | |
| Number of Equivalent Gates | 888439 | |
| Number of CLBs | 4704 | |
| Combinatorial Delay of a CLB-Max | 800 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 4704 CLBS, 888439 GATES | |
| Clock Frequency-Max | 250 MHz | |
| Supply Voltage-Max | 2.625 V | |
| Supply Voltage-Min | 2.375 V | |
| JESD-30 Code | S-PBGA-B560 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 3 | |
| Peak Reflow Temperature (Cel) | 260 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 560 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LBGA | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, LOW PROFILE | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1.27 mm | |
| Terminal Position | BOTTOM | |
| Width | 42.5 mm | |
| Length | 42.5 mm | |
| Seated Height-Max | 1.7 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | LBGA, | |
| Pin Count | 560 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 |
XCV800-4BGG560I Datasheet Download
XCV800-4BGG560I Overview
The chip model XCV800-4BGG560I is a highly advanced technology designed and developed by XYZ Company. It is a multi-functional chip that has been designed to meet the needs of a wide variety of industries. It is a highly efficient and reliable chip that can be used to power a variety of devices and applications.
The XCV800-4BGG560I chip model has a number of advantages over other chip models. It is capable of providing high performance and low power consumption, making it an ideal choice for many industries. Additionally, it is highly versatile and can be used in a wide range of applications. It also has a wide range of features and capabilities, making it suitable for a variety of projects and applications.
The XCV800-4BGG560I chip model is expected to have increasing demand in the future due to its many advantages. It is a highly reliable chip that can be used in a variety of industries, from automotive to medical. It is also a highly efficient chip that can be used in a wide range of applications. Additionally, it is a highly versatile chip that can be used for a variety of projects and applications.
In order to use the XCV800-4BGG560I chip model effectively, it is important to understand its product description and specific design requirements. It is important to understand the features and capabilities of the chip model in order to be able to use it effectively. Additionally, it is important to understand the actual case studies and precautions associated with the chip model in order to ensure that it is used safely and effectively.
The XCV800-4BGG560I chip model can be applied to the development and popularization of future intelligent robots. This chip model is highly efficient and reliable, making it an ideal choice for powering a variety of robots. Additionally, it is highly versatile and can be used in a wide range of applications. In order to use this chip model effectively, it is important to have a good understanding of the product description, design requirements, and actual case studies associated with the chip model. Additionally, it is important to have a good understanding of the technical talents needed to use the chip model effectively, such as software engineers, hardware engineers, and robotics experts.
In conclusion, the XCV800-4BGG560I chip model is a highly advanced technology that has a number of advantages over other chip models. It is expected to have increasing demand in the future due to its many advantages. Additionally, it can be applied to the development and popularization of future intelligent robots. In order to use the chip model effectively, it is important to understand its product description and specific design requirements, as well as actual case studies and precautions. Additionally, it is important to understand the technical talents needed to use the chip model effectively.
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