
AMD Xilinx
XCV800-4BGG560C
XCV800-4BGG560C ECAD Model
XCV800-4BGG560C Attributes
Type | Description | Select |
---|---|---|
Pbfree Code | Yes | |
Rohs Code | Yes | |
Part Life Cycle Code | Obsolete | |
Supply Voltage-Nom | 2.5 V | |
Number of Equivalent Gates | 888439 | |
Number of CLBs | 4704 | |
Combinatorial Delay of a CLB-Max | 800 ps | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Temperature Grade | OTHER | |
Package Shape | SQUARE | |
Technology | CMOS | |
Organization | 4704 CLBS, 888439 GATES | |
Clock Frequency-Max | 250 MHz | |
Supply Voltage-Max | 2.625 V | |
Supply Voltage-Min | 2.375 V | |
JESD-30 Code | S-PBGA-B560 | |
Qualification Status | Not Qualified | |
JESD-609 Code | e1 | |
Moisture Sensitivity Level | 3 | |
Operating Temperature-Max | 85 °C | |
Peak Reflow Temperature (Cel) | 260 | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Number of Terminals | 560 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | LBGA | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY, LOW PROFILE | |
Surface Mount | YES | |
Terminal Finish | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | |
Terminal Form | BALL | |
Terminal Pitch | 1.27 mm | |
Terminal Position | BOTTOM | |
Width | 42.5 mm | |
Length | 42.5 mm | |
Seated Height-Max | 1.7 mm | |
Ihs Manufacturer | XILINX INC | |
Part Package Code | BGA | |
Package Description | LBGA, | |
Pin Count | 560 | |
Reach Compliance Code | compliant | |
HTS Code | 8542.39.00.01 |
XCV800-4BGG560C Datasheet Download
XCV800-4BGG560C Overview
The chip model XCV800-4BGG560C is a powerful and versatile application processor designed for a wide range of applications. It is designed to be used in the era of fully intelligent systems and is capable of supporting a variety of advanced technologies, such as artificial intelligence, machine learning, and natural language processing. This chip model is suitable for a variety of intelligent scenarios, such as autonomous driving, voice recognition, and facial recognition.
In terms of industry trends, the chip model XCV800-4BGG560C is designed to be used in networks and is capable of providing high-performance computing power for a variety of applications. It is designed to be used in the era of fully intelligent systems, and its advanced features make it suitable for a range of intelligent scenarios. It is also capable of supporting a variety of new technologies, such as 5G, edge computing, and blockchain.
In terms of product description, the chip model XCV800-4BGG560C is a powerful and versatile application processor. It is designed to be used in networks and is capable of providing high-performance computing power for a variety of applications. It is equipped with a multi-core processor, a high-performance GPU, and a high-bandwidth memory controller, allowing for the efficient execution of multiple tasks simultaneously. It also supports a variety of advanced technologies, such as artificial intelligence, machine learning, and natural language processing.
In terms of design requirements, the chip model XCV800-4BGG560C is designed to be used in networks and is capable of providing high-performance computing power for a variety of applications. It is designed to be used in the era of fully intelligent systems, and its advanced features make it suitable for a range of intelligent scenarios. It is also capable of supporting a variety of new technologies, such as 5G, edge computing, and blockchain.
In terms of actual case studies and precautions, the chip model XCV800-4BGG560C has been used in a variety of applications, such as autonomous driving, voice recognition, and facial recognition. It is important to ensure that the chip model is properly configured to meet the specific requirements of the application. Additionally, it is important to ensure that the chip model is properly tested and certified to meet the necessary safety and security standards.
In conclusion, the chip model XCV800-4BGG560C is a powerful and versatile application processor designed for a wide range of applications. It is designed to be used in the era of fully intelligent systems and is capable of supporting a variety of advanced technologies, such as artificial intelligence, machine learning, and natural language processing. It is suitable for a variety of intelligent scenarios, such as autonomous driving, voice recognition, and facial recognition. Additionally, it is important to ensure that the chip model is properly configured and tested to meet the necessary safety and security standards.
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5,322 In Stock






Pricing (USD)
QTY | Unit Price | Ext Price |
---|---|---|
1+ | $836.3125 | $836.3125 |
10+ | $827.3199 | $8,273.1994 |
100+ | $782.3569 | $78,235.6896 |
1000+ | $737.3939 | $368,696.9280 |
10000+ | $674.4456 | $674,445.6000 |
The price is for reference only, please refer to the actual quotation! |