AMD Xilinx
XCV600E-8FGG900C
XCV600E-8FGG900C ECAD Model
XCV600E-8FGG900C Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 1.8 V | |
| Number of Inputs | 512 | |
| Number of Outputs | 512 | |
| Number of Logic Cells | 15552 | |
| Number of Equivalent Gates | 186624 | |
| Number of CLBs | 3456 | |
| Combinatorial Delay of a CLB-Max | 400 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 3456 CLBS, 186624 GATES | |
| Clock Frequency-Max | 416 MHz | |
| Power Supplies | 1.2/3.6,1.8 V | |
| Supply Voltage-Max | 1.89 V | |
| Supply Voltage-Min | 1.71 V | |
| JESD-30 Code | S-PBGA-B900 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | 250 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 900 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA900,30X30,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 31 mm | |
| Length | 31 mm | |
| Seated Height-Max | 2.6 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | BGA, BGA900,30X30,40 | |
| Pin Count | 900 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 | |
| ECCN Code | EAR99 |
XCV600E-8FGG900C Datasheet Download
XCV600E-8FGG900C Overview
The XCV600E-8FGG900C chip model from Xilinx is a high-performance FPGA (Field Programmable Gate Array) that is designed for digital signal processing, embedded processing, and image processing. It is a cost-effective solution for high-speed, high-performance applications that require the use of HDL language.
The XCV600E-8FGG900C chip model has several advantages over other FPGA models. It has a high-performance, low-cost design with a wide range of features, making it suitable for a variety of applications. It also has a high-speed, low-power architecture that allows for efficient operation in a variety of applications. Additionally, it has a large number of I/O pins, allowing for a wide range of applications and connectivity.
The demand for the XCV600E-8FGG900C chip model is expected to increase in the future due to the increasing need for high-performance, low-cost solutions for digital signal processing, embedded processing, and image processing. The model is particularly well-suited for applications that require the use of HDL language, as it allows for efficient and effective programming.
The product description and specific design requirements of the XCV600E-8FGG900C chip model include a wide range of features, such as a high-performance, low-cost design, a high-speed, low-power architecture, and a large number of I/O pins. Additionally, the model is equipped with a wide range of peripherals, such as memory controllers, Ethernet controllers, and USB controllers.
When designing with the XCV600E-8FGG900C chip model, it is important to consider the specific requirements of the application. It is also important to consider the power requirements, as the model is designed for efficient operation. Additionally, it is important to consider the I/O requirements, as the model has a large number of I/O pins.
In conclusion, the XCV600E-8FGG900C chip model from Xilinx is a high-performance FPGA that is designed for digital signal processing, embedded processing, and image processing. It has a high-performance, low-cost design with a wide range of features, making it suitable for a variety of applications. Additionally, it has a high-speed, low-power architecture that allows for efficient operation in a variety of applications. The demand for the XCV600E-8FGG900C chip model is expected to increase in the future due to the increasing need for high-performance, low-cost solutions for digital signal processing, embedded processing, and image processing. When designing with the XCV600E-8FGG900C chip model, it is important to consider the specific requirements of the application, the power requirements, and the I/O requirements.
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