AMD Xilinx
XCV600E-8FGG676I
XCV600E-8FGG676I ECAD Model
XCV600E-8FGG676I Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 1.8 V | |
| Number of Inputs | 444 | |
| Number of Outputs | 444 | |
| Number of Logic Cells | 15552 | |
| Number of Equivalent Gates | 186624 | |
| Number of CLBs | 3456 | |
| Combinatorial Delay of a CLB-Max | 400 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 3456 CLBS, 186624 GATES | |
| Clock Frequency-Max | 416 MHz | |
| Power Supplies | 1.2/3.6,1.8 V | |
| Supply Voltage-Max | 1.89 V | |
| Supply Voltage-Min | 1.71 V | |
| JESD-30 Code | S-PBGA-B676 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 3 | |
| Peak Reflow Temperature (Cel) | 250 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 676 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA676,26X26,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 27 mm | |
| Length | 27 mm | |
| Seated Height-Max | 2.6 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | BGA, BGA676,26X26,40 | |
| Pin Count | 676 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 |
XCV600E-8FGG676I Datasheet Download
XCV600E-8FGG676I Overview
The XCV600E-8FGG676I chip model is a cutting-edge technology that is revolutionizing the way digital signal processing, embedded processing, and image processing are being done. This model of chip is designed to be used with the HDL language, which allows for the development of complex algorithms and systems that can be used for a variety of applications.
The XCV600E-8FGG676I chip model has a number of advantages compared to other models. It is designed to process data faster, while also being more energy efficient. This makes it ideal for applications where speed and efficiency are key. It also has a higher level of integration, meaning that it can be used in systems that require more complex algorithms and processes.
The demand for the XCV600E-8FGG676I chip model is expected to increase in the future, as more industries and applications make use of its capabilities. It is likely to be used in a variety of applications, from medical imaging to industrial automation. It is also likely to be used in networks, as it can be used to process large amounts of data quickly and efficiently.
The XCV600E-8FGG676I chip model can also be used in intelligent scenarios. It is capable of processing data quickly and accurately, making it ideal for applications such as facial recognition and natural language processing. This chip model is also likely to be used in the era of fully intelligent systems, as it is capable of handling complex algorithms and processes that are required for these systems.
In conclusion, the XCV600E-8FGG676I chip model is a powerful and efficient technology that can be used in a variety of applications. It is capable of processing data quickly and accurately, making it ideal for digital signal processing, embedded processing, image processing, and intelligent scenarios. The demand for this chip model is expected to increase in the future, as more industries and applications make use of its capabilities.
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3,381 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $238.0800 | $238.0800 |
| 10+ | $235.5200 | $2,355.2000 |
| 100+ | $222.7200 | $22,272.0000 |
| 1000+ | $209.9200 | $104,960.0000 |
| 10000+ | $192.0000 | $192,000.0000 |
| The price is for reference only, please refer to the actual quotation! | ||